US2012288979A1PendingUtilityA1
Solid-state image sensor and imaging system
Est. expirySep 3, 2024(expired)· nominal 20-yr term from priority
H10F 39/803H10F 39/8063H10F 39/8053H10F 39/8037H10F 39/806H10F 39/805H10F 39/18H10F 39/811
69
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Claims
Abstract
At least one exemplary embodiment is directed to a solid state image sensor including at least one antireflective layer and/or non rectangular shaped wiring layer cross section to reduce dark currents and 1/f noise.
Claims
exact text as granted — not AI-modified1 . A method of formation of a solid state image sensor comprising: depositing at least one source-drain region of MOS transistors; depositing a first layer on the at least one source drain region; planarizing the first layer; depositing a plurality of mixed layers, wherein a mixed layer includes an insulating layer and a wiring layer, wherein the wiring layer furthest from the first layer is referred to as the outer wiring layer; planarizing each of the mixed layers in the plurality of alternating layers; depositing a plasma SiN layer on the outer wiring layer; heating the plasma SiN layer at a target temperature in a target environment for a target period of time; and depositing an optical element on the plasma SiN layer.
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