US2012288979A1PendingUtilityA1

Solid-state image sensor and imaging system

Assignee: KOIZUMI TORUPriority: Sep 3, 2004Filed: Jul 23, 2012Published: Nov 15, 2012
Est. expirySep 3, 2024(expired)· nominal 20-yr term from priority
H10F 39/803H10F 39/8063H10F 39/8053H10F 39/8037H10F 39/806H10F 39/805H10F 39/18H10F 39/811
69
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

At least one exemplary embodiment is directed to a solid state image sensor including at least one antireflective layer and/or non rectangular shaped wiring layer cross section to reduce dark currents and 1/f noise.

Claims

exact text as granted — not AI-modified
1 . A method of formation of a solid state image sensor comprising:
 depositing at least one source-drain region of MOS transistors;   depositing a first layer on the at least one source drain region;   planarizing the first layer;   depositing a plurality of mixed layers, wherein a mixed layer includes an insulating layer and a wiring layer, wherein the wiring layer furthest from the first layer is referred to as the outer wiring layer;   planarizing each of the mixed layers in the plurality of alternating layers;   depositing a plasma SiN layer on the outer wiring layer;   heating the plasma SiN layer at a target temperature in a target environment for a target period of time; and   depositing an optical element on the plasma SiN layer.

Join the waitlist — get patent alerts

Track US2012288979A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.