Heat dissipation assembly for electronic device

Abstract

A heat dissipation assembly includes a heat sink and an airflow guide. The airflow guide includes a top wall, two sidewalls connected to the top wall, and an airflow guide component mounted on an inner surface of the top wall. The top wall and the two sidewalls cooperatively define an air passage for allowing air to flow through. The heat sink is disposed in the air passage and the airflow guide component is configured to guide air through the air passage to the heat sink.

1 . A heat dissipation assembly, comprising:
 a heat sink; and   an airflow guide comprising:
 a top wall; 
 two sidewalls extending from the top wall, the top wall and the two sidewalls cooperatively defining an air passage, the air passage being configured for allowing air to flow through, the heat sink being received in the air passage; and 
 an airflow guide component mounted on an inner surface of the top wall and received in the air passage, the airflow guide component being configured for guiding air in the air passage to the heat sink. 
   
     
     
         2 . The heat dissipation assembly of  claim 1 , wherein the airflow guide component is detachably mounted on the top wall. 
     
     
         3 . The heat dissipation assembly of  claim 1 , wherein the top wall and the airflow guide component are integrally formed with each other. 
     
     
         4 . The heat dissipation assembly of  claim 1 , wherein the air passage comprises an air inlet and an air outlet, the airflow guide component comprises an airflow guide surface facing the air inlet and obliquely relative to the top wall, and the airflow guide surface is configured for guiding the air in the air passage to the heat sink. 
     
     
         5 . The heat dissipation assembly of  claim 4 , wherein the airflow guide component is a triangular prism, and the airflow guide surface is a surface of the triangular prism. 
     
     
         6 . The heat dissipation assembly of  claim 4 , wherein the airflow guide component comprises a fixing part and an airflow guide part connected to the fixing part, and the airflow guide surface is a surface of the airflow guide part. 
     
     
         7 . The heat dissipation assembly of  claim 2 , wherein the top wall comprises a first fixing component, the airflow guide component comprises a second fixing component, and the second fixing component is coupled to the first fixing component so that the airflow guide component is fixed on the top wall. 
     
     
         8 . The heat dissipation assembly of  claim 7 , wherein the first fixing component is a fixing hole defined in the inner surface of the top wall, the second fixing component is a fixing rod extending from a surface of the airflow guide component, the fixing rod is received in the fixing hole. 
     
     
         9 . The heat dissipation assembly of  claim 7 , wherein the first fixing component is a fixing rod extending from the inner surface of the top wall, the second fixing component is a fixing hole defined in a surface of the airflow guide component, the fixing rod is received in the fixing hole. 
     
     
         10 . The heat dissipation assembly of  claim 7 , wherein the airflow guide comprises a fixing plate positioned on the inner surface of the top wall, the first fixing component is an engaging slot defined between the inner surface of the top wall and the fixing plate, the second fixing component is an engaging part, the engaging part is received in the engaging slot. 
     
     
         11 . The heat dissipation assembly of  claim 7 , wherein the first fixing component is an engaging part extending from the inner surface of the top wall, and the second fixing component is an engaging slot defined in a surface of the airflow guide component, the engaging part is received in the engaging slot.