Microsystem

Abstract

A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

1 . A microsystem, comprising:
 a first cavity sealed off from the surroundings, wherein the first cavity is bounded by a first bond joint; and   a second cavity sealed off from the surroundings, wherein the second cavity is bounded by a second bond joint;   wherein one of the first bond joint or the second bond joint is one of a eutectic bond joint or a diffusion-soldered joint.   
     
     
         2 . The microsystem as recited in  claim 1 , wherein a first pressure exists in the first cavity and a second pressure exists in the second cavity, the magnitude of the first pressure being different from the magnitude of the second pressure. 
     
     
         3 . The microsystem as recited in  claim 2 , wherein the first bond joint includes aluminum and gold, and wherein the second bond joint includes aluminum and silicon. 
     
     
         4 . The microsystem as recited in  claim 2 , wherein the first bond joint includes copper, and wherein the second bond joint includes copper and tin. 
     
     
         5 . The microsystem as recited in  claim 2 , wherein a first sensor structure is disposed in the first cavity, and wherein a second sensor structure is disposed in the second cavity. 
     
     
         6 - 10 . (canceled)