Interconnection structure made of redirected carbon nanotubes

Abstract

The invention relates to an electronic device including electric connections extending along at least two different directions, said connections being essentially formed by means of bundles of carbon nanotubes (CNT) ( 8 ), where at least two CNT bundles comprise a portion ( 8 a ) having its axis directed along a first direction and a portion ( 8 b ) having its axis redirected along a second direction, the connections between CNT bundles being achieved by overlapping of the portions ( 8 b ) of said at least two bundles to form a connection line ( 4 ).

1 - 13 . (canceled) 
     
     
         14 . An electronic device comprising electric connections extending along at least two different directions, said connections being formed by means of carbon nanotube (CNT) bundles, wherein at least two CNT bundles each comprise a portion having an axis directed along a first direction and a portion having an axis redirected along a second direction, the connections being achieved by connecting portions of said at least two CNT bundles to form a connection line. 
     
     
         15 . The electronic device of  claim 14 , wherein the at least two different directions are substantially perpendicular. 
     
     
         16 . The electronic device of  claim 14 , wherein the first direction is substantially vertical and the CNT bundle portion having an axis directed along the first direction forms a via. 
     
     
         17 . The electronic device of  claim 14 , wherein the second direction is substantially horizontal and the CNT bundle portion having an axis redirected along the second direction forms a connection line. 
     
     
         18 . The electronic device of  claim 17 , wherein the connection line comprises a metal layer. 
     
     
         19 . The electronic device of  claim 14 , wherein the electronic device further comprises another CNT bundle laterally connected to at least one of the at least two CNT bundles, at the portion of the CNT bundle having an axis redirected along the second direction, to form the connection line. 
     
     
         20 . The electronic device of  claim 19 , wherein the other CNT bundle is laterally connected to at least two CNT bundles to ensure the connection between vias. 
     
     
         21 . A method of creating electric connections extending along at least two directions of the electronic device of claim  1 , the method comprising:
 growing at least two CNT bundles along a first direction in a cavity of said device; and   redirecting a portion of said at least two CNT bundles along a second direction by flowing a liquid to form a connection line.   
     
     
         22 . The method of  claim 21 , wherein:
 growing at least two CNT bundles along the first direction is carried out within vias;   a portion of the at least two CNT bundles is redirected along the second direction; and   the portions of the at least two CNT bundles redirected along the second direction are connected by overlapping to form the connection line.   
     
     
         23 . The method of  claim 21 , comprising depositing at least one metal layer on the portion of the at least two CNT bundles redirected along the second direction. 
     
     
         24 . The method of  claim 21 , comprising growing, and optionally redirecting along the second direction, another CNT bundle to connect laterally at least one CNT bundle to the portion of the CNT bundle redirected along the second direction, to form the connection line. 
     
     
         25 . The method of  claim 24 , comprising depositing a metal layer on the other CNT bundle. 
     
     
         26 . The method of  claim 21 , comprising depositing TiN on areas where CNT bundles should not grow.