Package structure and manufacturing method thereof

Abstract

A manufacturing method of a package structure is provided. A substrate having an upper surface and a lower surface opposite to each other and an opening communicating the surfaces is provided. An electronic device is configured in the opening. An adhesive layer and a patterned metal layer located on the adhesive layer are laminated on the lower surface and expose a bottom surface of the electronic device. A heat-dissipating column is formed on the bottom surface exposed by the adhesive layer and the patterned metal layer and connects the patterned metal layer and the bottom surface. A first and a second laminated structures are laminated on the upper surface of the substrate and the patterned metal layer, respectively. The first laminated structure covers the upper surface of the substrate and a top surface of the electronic device. The second laminated structure covers the heat-dissipating column and the patterned metal layer.

1 . A manufacturing method of a package structure, comprising:
 providing a substrate, the substrate having an upper surface, a lower surface, and an opening, the upper surface and the lower surface being opposite to each other, the opening communicating the upper surface and the lower surface;   configuring an electronic device in the opening of the substrate;   laminating an adhesive layer and a patterned metal layer located on the adhesive layer on the lower surface of the substrate, the adhesive layer and the patterned metal layer exposing a bottom surface of the electronic device;   forming a heat-dissipating column on the bottom surface of the electronic device exposed by the adhesive layer and the patterned metal layer, the heat-dissipating column connecting the patterned metal layer and the bottom surface of the electronic device; and   respectively laminating a first laminated structure and a second laminated structure on the upper surface of the substrate and the patterned metal layer, the first laminated structure covering the upper surface of the substrate and a top surface of the electronic device, the second laminated structure covering the heat-dissipating column and the patterned metal layer.   
     
     
         2 . The manufacturing method of the package structure as recited in  claim 1 , wherein the electronic device comprises a radio frequency device, an active device, or a passive device. 
     
     
         3 . The manufacturing method of the package structure as recited in  claim 1 , wherein the first laminated structure comprises at least one first dielectric layer, at least one first patterned metal layer, and at least one conductive via penetrating the at least one first dielectric layer, the at least one first dielectric layer and the at least one first patterned metal layer are sequentially stacked on the upper surface of the substrate, the opening is filled with the at least one first dielectric layer, and the at least one first patterned metal layer is electrically connected to the electronic device through the at least one conductive via. 
     
     
         4 . The manufacturing method of the package structure as recited in  claim 1 , wherein the second laminated structure comprises at least one second dielectric layer and at least one second patterned metal layer, the at least one second dielectric layer and the at least one second patterned metal layer are stacked on the patterned metal layer and the heat-dissipating column, and the heat-dissipating column is in physical contact with the at least one second patterned metal layer. 
     
     
         5 . The manufacturing method of the package structure as recited in  claim 1 , after laminating the first laminated structure and the second laminated structure on the upper surface of the substrate and the patterned metal layer, further comprising:
 forming a first solder mask layer on the first laminated structure; and   forming a second solder mask layer on the second laminated structure.   
     
     
         6 . The manufacturing method of the package structure as recited in  claim 1 , wherein a method of laminating the first laminated structure and the second laminated structure on the upper surface of the substrate and the patterned metal layer comprises thermal lamination. 
     
     
         7 . The manufacturing method of the package structure as recited in  claim 1 , wherein a method of forming the heat-dissipating column on the bottom surface of the electronic device exposed by the adhesive layer and the patterned metal layer comprises plating. 
     
     
         8 . A package structure, comprising:
 a substrate having an upper surface, a lower surface, and an opening, the upper surface and the lower surface being opposite to each other, the opening communicating the upper surface and the lower surface;   an electronic device configured in the opening of the substrate and having a top surface and a bottom surface, the top surface and the bottom surface being opposite to each other;   an adhesive layer configured on the lower surface of the substrate and exposing the bottom surface of the electronic device;   a patterned metal layer adhered to the lower surface of the substrate through the adhesive layer and exposing the bottom surface of the electronic device;   a heat-dissipating column configured on the bottom surface of the electronic device exposed by the adhesive layer and the patterned metal layer, the heat-dissipating column connecting the patterned metal layer and the bottom surface of the electronic device;   a first laminated structure configured on the upper surface of the substrate and covering the upper surface of the substrate and the top surface of the electronic device; and   a second laminated structure configured on the patterned metal layer and covering the heat-dissipating column and the patterned metal layer.   
     
     
         9 . The package structure as recited in  claim 8 , wherein the electronic device comprises a radio frequency device, an active device, or a passive device. 
     
     
         10 . The package structure as recited in  claim 8 , wherein the first laminated structure comprises at least one first dielectric layer, at least one first patterned metal layer, and at least one conductive via penetrating the at least one first dielectric layer, the at least one first dielectric layer and the at least one first patterned metal layer are sequentially stacked on the upper surface of the substrate, the opening is filled with the at least one first dielectric layer, and the at least one first patterned metal layer is electrically connected to the electronic device through the at least one conductive via. 
     
     
         11 . The package structure as recited in  claim 8 , wherein the second laminated structure comprises at least one second dielectric layer and at least one second patterned metal layer, the at least one second dielectric layer and the at least one second patterned metal layer are stacked on the patterned metal layer and the heat-dissipating column, and the heat-dissipating column is in physical contact with the at least one second patterned metal layer. 
     
     
         12 . The package structure as recited in  claim 8 , further comprising:
 a first solder mask layer configured on the first laminated structure; and   a second solder mask layer configured on the second laminated structure.