Massively parallel lithography with two-dimensional pen arrays

Abstract

Massive parallel printing of structures and nanostructures at high speed with high resolution and high quality using two dimensional arrays comprising cantilevers and tip-based transfer of material to a surface. The array is designed so only tips touch the surface. This can be accomplished by long tips and bent cantilevers and alignment. An article comprising: a two-dimensional array of a plurality of cantilevers, wherein the array comprises a plurality of base rows, each base row comprising a plurality of cantilevers, wherein each of the cantilevers comprise tips at the cantilever end away from the base, wherein the number of cantilevers is greater than 250, and wherein the tips have an apex height relative to the cantilever of at least four microns, and a support for the array. Combinatorial arrays and bioarrays can be prepared. The arrays can be manufactured by micromachining methods.

1 .- 60 . (canceled) 
     
     
         61 . A method of making article, wherein the article comprises a two-dimensional array of a plurality of cantilevers, and a support for the array, the method comprising: forming a two dimensional array comprising a plurality of cantilevers comprising tips at their ends, wherein the cantilevers are supported on a sacrificial support structure; forming an array support comprising a plurality of base rows which are adapted for bonding to the two dimensional array comprising a plurality of cantilevers; bonding the cantilevers to the base rows; and removing the sacrificial support structure to release the cantilevers and form the array. 
     
     
         62 . The method according to  claim 61 , wherein the array is adapted to prevent substantial contact of non-tip components of the array when the tips are brought into contact with a substantially planar surface. 
     
     
         63 . A method according to  claim 61 , wherein the tips have an apex height relative to the cantilever of at least four microns. 
     
     
         64 .- 65 . (canceled) 
     
     
         66 . A method according to  claim 61 , further comprising the step of bending the cantilevers at an angle of at least 10° away from the support. 
     
     
         67 . A method according to  claim 61 , wherein the tips have an apex height relative to the cantilever of at least 4 microns, and wherein the cantilevers are bent at an angle away from the support. 
     
     
         68 . (canceled) 
     
     
         69 . A method according to  claim 61 , wherein the array is characterized by a cantilever yield of at least 95%. 
     
     
         70 . A method according to  claim 61 , wherein the array is characterized by a tip spacing of less than 200 microns in one dimension and a tip spacing of less than 50 microns in a second dimension. 
     
     
         71 . A method according to  claim 61 , wherein the number of cantilevers is greater than 10,000. 
     
     
         72 . A method according to  claim 61 , wherein the base rows have an average length of at least about 1 mm. 
     
     
         73 . A method according to  claim 61 , wherein the cantilevers comprise multiple layers adapted for bending of cantilevers. 
     
     
         74 . A method according to  claim 61 , wherein the cantilevers are coated with metal on the tip side of the cantilever. 
     
     
         75 . A method according to  claim 61 , wherein the cantilevers are not adapted for force feedback. 
     
     
         76 . A method according to  claim 61 , wherein the base rows have a height with respect to the support of at least about 5 microns. 
     
     
         77 . A method according to  claim 61 , wherein the tips have an average radius of curvature of less than 100 nm. 
     
     
         78 . A method according to  claim 61 , wherein the cantilevers have an average force constant of about 0.1 N/m to about 1 N/m. 
     
     
         79 . (canceled) 
     
     
         80 . A method according to  claim 61 , wherein the cantilevers are bent on average about 10 microns to about 50 microns. 
     
     
         81 . A method according to  claim 61 , wherein the bonding step is a non-adhesive bonding. 
     
     
         82 . (canceled) 
     
     
         83 . A method according to  claim 61 , wherein the forming of the two dimensional array comprises microfabrication. 
     
     
         84 . A method according to  claim 61 , wherein the forming of the array support comprises microfabrication. 
     
     
         85 . A method according to  claim 61 , wherein after the bonding step, the array support is scribed into sections about 2 square cm or less. 
     
     
         86 .- 104 . (canceled)