Method for the production and control of plates for electronics and related apparatus

Abstract

A method for the production and control of plates for electronics comprising a first step in which a plate is positioned, by positioning means, in a loading station; a second step in which the plate is disposed in a deposition station associated with a unit for depositing metal or other material; a third step in which the plate is disposed in an exit station and a detection means is activated to detect the presence of defects in the plate; and a fourth step in which the plate is discharged from the exit station. In the first step, the detection means is activated to identify defects in the plate disposed in the loading station. In the second step, the deposition unit is activated in order to deposit the metal on the plate when in the first step the detection means has not detected any defect in the plate.

1 . A method for the production and control of plates for electronics comprising:
 a first step in which a plate is positioned, by means of positioning means, in a loading station;   a second step in which the plate is disposed in a deposition station associated with a unit for depositing metal, or other material, in which the metal or other material is deposited on the plate, in order to generate on the plates tracks made of metal or other material, according to a pre-determined and desired topological disposition;   a third step in which the plate is disposed in an exit station and a detection means is activated so as to detect the presence of defects in the plate; and   a fourth step in which the plate is discharged from the exit station, wherein in said first step said detection means is activated to identify defects in said plate disposed in the loading station and wherein in said second step the deposition unit is activated in order to deposit the metal or other material on said plate when in said first step the detection means has not detected any defect in said plate.   
     
     
         2 . A method as in  claim 1 , wherein in said fourth step the plate without defects is discharged by means of positioning means in a first direction of discharge. 
     
     
         3 . A method as in  claim 1 , wherein in said fourth step the plate with defects is discharged by means of said positioning means in a second direction of discharge. 
     
     
         4 . A method as in  claim 1 , wherein said fourth step comprises a sub-step, subsequent to the discharge of the plate from the exit station, in which said positioning means is cleaned in order to remove impurities. 
     
     
         5 . A method as in  claim 4 , wherein said positioning means is cleaned by means of air suction. 
     
     
         6 . A method as in  claim 1 , wherein said detection means comprises at least a TV camera.