Metal etching method, metal etching control method and control device thereof

Abstract

Disclosed is a metal etching method, a metal etching control method and a control device thereof. The metal etching control method is employed in a metal wet etching machine and comprises steps below: performing etching to a metal film and acquiring an etching end time of the metal film; multiplying the etching end time with a constant ratio to acquire the over etching time of the metal film; and performing etching to the metal film with the over etching time to complete the etching to the metal film. The present invention can precisely judge a total real etching time needed for each of a batch of metal films as performing metal etching to the metal films to reduce the issue of unstable etching qualities as the metal film thicknesses are not regular.

1 . A metal etching control device, comprising:
 a first acquiring module, acquiring an etching end time of the metal film;   a second acquiring module, acquiring an over etching time according to the etching end time and a preset algorithm; and   a delivering module, delivering the over etching time to a metal wet etching machine, so that the metal wet etching machine keeps performing etching to the metal film with the over etching time hereby to complete the etching to the metal film.   
     
     
         2 . The metal etching control device of  claim 1 , wherein the first acquiring module is an end point sensor. 
     
     
         3 . The metal etching control device of  claim 2 , wherein the end point sensor is located inside the metal wet etching machine for detecting the etching end time of the metal film during the etching. 
     
     
         4 . The metal etching control device of  claim 1 , wherein the preset algorithm is to multiply the etching end time with a constant ratio to acquire the over etching time. 
     
     
         5 . The metal etching control device of  claim 1 , wherein the preset algorithm of the second acquiring module is to multiply the etching end time with a first ratio to acquire the over etching time, and the first ratio is a sum of a constant ratio plus an extra necessary fixed ratio, which is presupposed according to the metal film etching times performed by the metal wet etching machine. 
     
     
         6 . The metal etching control device of  claim 1 , wherein the preset algorithm of the second acquiring module is to multiply the etching end time with a second ratio to acquire the over etching time, and the second ratio is a sum of a constant ratio plus an extra percentage, which is presupposed according to the increase of the etching end time. 
     
     
         7 . The metal etching control device of  claim 6 , wherein the extra percentage is an extra linear increasing percentage, an arithmetic series percentage or a geometric series percentage.