Copper alloy having high strength and high conductivity, and method for preparing the same

Abstract

The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt %, Si 0.01˜0.25 wt % Mg, and the balance of Cu and minor impurities. The method of making the copper alloy includes: forming the molten alloy, casting to obtain an ingot, hot rolling the ingot at 850˜1,000° C., cooling, cold rolling the hot rolled product (after cooling the same), annealing the cold rolled product at 400˜600° C. for 1˜10 hours, intermediate rolling the annealed product with a reduction ratio of 30˜70%, heat treating the intermediate rolled product at 500˜800° C. for 30˜600 seconds, and finishing rolling the heat treated product with a reduction ratio of 20˜40%.

1 . A high strength and high conductibility copper alloy in 100 wt % composition, consisting of:
 0.05˜0.25 wt % Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt % Si, 0.01˜0.24 wt % Mg, and   a balance of Cu and impurities.   
     
     
         2 . The copper alloy as claimed in  claim 1 , wherein:
 the composition includes less than 1.0 wt % of at least one selected from the group consisting of Zn, Sn, Mn, Al, and Ni.   
     
     
         3 . The copper alloy as claimed in  claim 1 , wherein:
 the Fe, Mg, and P have a ratio of (Mg+Fe)/P=0.4˜50.   
     
     
         4 . The copper alloy as claimed in  claim 3 , wherein:
 the Fe, Mg, and P have a ratio of (Mg+Fe)/P=2˜10.   
     
     
         5 . The copper alloy as claimed in  claim 1 , wherein:
 the Cr, Mg, and Si have a ratio of (Cr+Mg)/Si=0.1˜50.   
     
     
         6 . The copper alloy as claimed in  claim 5 , wherein:
 the Cr, Mg, and Si have a ratio of (Cr+Mg)/Si=1˜10.   
     
     
         7 . A method for preparing a high strength and high conductibility copper alloy, comprising the steps of:
 forming a molten metal of a high strength and high conductivity copper alloy consisting of, in 100 wt % composition, 0.05˜0.25 wt % Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt % Si, 0.01˜0.24 wt % Mg, and a balance of Cu and impurities;   casting the molten metal to obtain an ingot;   hot rolling the ingot at 850˜1,000° C.;   cooling;   cold rolling after said cooling;   annealing at 400˜600° C. for 1˜10 hours;   intermediate rolling with a reduction ratio of 30˜70%;   heat treating at 500˜800° C. for 30˜600 seconds; and   finish cold rolling with a reduction ratio of 20˜40%.   
     
     
         8 . The method as claimed in  claim 7 , wherein:
 the composition includes less than 1.0 wt % of at least one selected from the group consisting of Zn, Sn, Mn, Al, and Ni.   
     
     
         9 . The method as claimed in  claim 7 , wherein said method further comprises the step of:
 conducting a seasoning;   said step of seasoning including the step of making the copper alloy to secure high strength by forming an Fe—P group, an Mg—P group, and a Cr—Si group, a Mg—Si group deposits.   
     
     
         10 . The method as claimed in  claim 8 , wherein said method further comprises the step of:
 conducting a seasoning:   said step of seasoning including the step of making the copper alloy to secure high strength by forming an Fe—P group, an Mg—P group, and a Cr—Si group, a Mg—Si group deposits.