Heat dissipation device

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base; and a heat pipe including an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.

1 . A heat dissipation device comprising:
 a first base;   a second base placed on the first base;   a fin set placed on the second base; and   a heat pipe comprising an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein a first receiving groove is defined in a top face of the first base, and the evaporating section is received in the first receiving groove. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein a top face of the evaporating section is coplanar with the top face of the first base. 
     
     
         4 . The heat dissipation device of  claim 2 , wherein a second receiving groove is defined in a bottom face of the fin set, and the condensing section is received in the second receiving groove. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein the bottom face of the condensing section is coplanar with the bottom face of the fin set. 
     
     
         6 . The heat dissipation device of  claim 1 , wherein a first recessed portion is defined in the top face of the first base, a cutout is defined in the second base, a second recessed portion is defined in the bottom face of the fin set, and the first recessed portion communicated with the cutout and the second recessed portion, thereby forming a receiving space. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein the connecting section is accommodated in the receiving space. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein an area of the second base is larger than that of the first base. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein the first base and the second base are both rectangular, and a width of the second base is equal to a length of the first base. 
     
     
         10 . The heat dissipation device of  claim 1 , wherein the heat pipe is U-shaped, and the evaporating section is parallel to the condensing section. 
     
     
         11 . The heat dissipation device of  claim 1 , wherein the fin set comprises a plurality of parallel fins engaging with each other. 
     
     
         12 . A heat dissipation device comprising:
 a base module, the base module comprising a first base and a second base disposed on the first base;   a fin set placed on the second base of the base module; and   a heat pipe comprising an evaporating section inserted into the base module, a condensing section thermally contacting the fin set, and a connecting section interconnecting the evaporating section and the condensing section.   
     
     
         13 . The heat dissipation device of  claim 12 , wherein the evaporating section is sandwiched between the first base and the second base. 
     
     
         14 . The heat dissipation device of  claim 13 , wherein a first receiving groove is defined in a top face of the first base, and the evaporating section is received in the first receiving groove. 
     
     
         15 . The heat dissipation device of  claim 13 , wherein the condensing section is sandwiched between the second base and the fin set. 
     
     
         16 . The heat dissipation device of  claim 15 , wherein a second receiving groove is defined in a bottom face of the fin set, and the condensing section is received in the second receiving groove. 
     
     
         17 . The heat dissipation device of  claim 12 , wherein a first recessed portion is defined in the top face of the first base, a cutout is defined in the second base, a second recessed portion is defined in the bottom face of the fin set, and the first recessed portion communicated with the cutout and the second recessed portion, thereby forming a receiving space. 
     
     
         18 . The heat dissipation device of  claim 17 , wherein the connecting section is accommodated in the receiving space. 
     
     
         19 . The heat dissipation device of  claim 12 , wherein an area of the second base is larger than that of the first base. 
     
     
         20 . The heat dissipation device of  claim 12 , wherein the heat pipe is U-shaped, and the evaporating section is parallel to the condensing section.