Temperature control unit for electronic component and handler apparatus

Abstract

A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an electronic component includes a cooling cycle device having a refrigerant passage circulating through a compressor, a condenser, an expander, and an evaporator; a thermally conductive block having an outer surface capable of coming in contact with the electronic component that is an object to be temperature-controlled, where an inner surface corresponding to the outer surface is placed opposite to the outer surface so as to be brought in contact with or apart from the evaporator; at least one first heater for heating the thermally conductive block; and a compressed air feeding circuit for feeding compressed air between facing surfaces of the evaporator and the thermally conductive block to part them.

1 . A temperature control unit for an electronic component comprising;
 a heat sink that radiates heat of the electronic component:   a thermally conductive block placed opposed the heat sink so as to be brought in contact with or apart from the heat sink;   a compressed air feeding circuit for feeding compressed air to a gap between facing surfaces of the heat sink and the thermally conductive block to apart them.   
     
     
         2 . The temperature control unit for an electronic component according to  claim 1 ,
 wherein the compressed air feeding circuit includes a device for drying the compressed air passing through the compressed air feeding circuit.   
     
     
         3 . The temperature control unit for an electronic component according to  claim 1 ,
 comprising a thermally conductive liquid feeding circuit for feeding a thermally conductive liquid between facing surfaces of the heat sink and the thermally conductive block.   
     
     
         4 . The temperature control unit for an electronic component according to  claim 1 ,
 wherein a first heater is placed at the thermally conductive block.   
     
     
         5 . The temperature control unit for an electronic component according to  claim 4 ,
 comprising at least one first temperature sensor fort detecting a temperature of the thermally conductive block, and
 a controller for controlling the temperature of the first heater, based on a detected value of the first temperature sensor. 
   
     
     
         6 . The temperature control unit for an electronic component according to  claim 5 ,
 wherein the compressed air feeding circuit includes a flow controller for controlling feeding of the compressed air passing through the compressed air feeding circuit.   
     
     
         7 . The temperature control unit for an electronic component according to  claim 6 ,
 the controller controls the now controller, based on the detected value of the first temperature sensor.   
     
     
         8 . The temperature control unit for an electronic component according to  claim 7 ,
 wherein the controller which controls the temperature of the first heater controls the flow controller.   
     
     
         9 . The temperature control unit for an electronic component according to  claim 1 ,
 wherein the heat sink is an evaporator that composes a refrigerant circuit.   
     
     
         10 . The temperature control unit for an electronic component according of  claim 9 ,
 further comprising a second heater for heating a pipe returning from the evaporator to the compressor that compresses the refrigerant circuit.   
     
     
         11 . The temperature control unit for an electronic component according to  claim 10 ,
 wherein the second heater includes an overheat protector for preventing that the second heater becomes a temperature higher than a predetermined temperature.   
     
     
         12 . The temperature control unit for an electronic component according to  claim 10 ,
 further comprising a second temperature sensor for detecting a temperature of the second heater, and a controller for controlling the operation of the second heater, based on a detected value of the second temperature sensor.   
     
     
         13 . The temperature control unit for an electronic component according to  claim 12 ,
 the controller that controls the first heater controls the second heater.   
     
     
         14 . The temperature control unit for an electronic component according to  claim 1 ,
 wherein the thermally conductive block has a shape surrounding the heat sink, a side wall of the thermally conductive block extended from surroundings of the outer surface capable of coming in contact with the electronic component is placed via a gap with respect to the heat sink, and the gap and the compressed air feeding circuit are in communication with each other.   
     
     
         15 . The temperature control unit for an electronic component according to  claim 5 ,
 wherein the first heater is placed on the side wall of the thermally conductive block   
     
     
         16 . The temperature control unit for an electronic component according to  claim 1 ,
 further comprising at least one suction pad at an outer periphery of the thermally conductive block, for vacuum-sucking the electronic component to pin the electronic component against the thermally conductive block.   
     
     
         17 . The temperature control unit for an electronic component according to  claim 16 ,
 wherein the suction pad is constituted so as to be extensible so that, when sucking is not performed, the suction pad is in an extended state, and a tip thereof is located at a position extruding from a surface of the thermally conductive block to come in contact with the electronic component, and when sucking is performed, the suction pad changes into a shrinked state,   
     
     
         18 . The temperature control unit for an electronic component according to  claim 1 ,
 further comprising a thermally conductive liquid feeder for feeding thermally conductive liquid having insulating property to an upper surface of the electronic component to be pinned against the thermally conductive block.   
     
     
         19 . A test apparatus for testing an electronic component, comprising
 a tester that tests the electronic component   a heat sink that radiates heat of the electronic component:   a thermally conductive block placed opposed the heat sink so as to be brought in contact with or apart from the heat sink;   a compressed air feeding circuit for feeding compressed air to a gap between facing surfaces of the heat sink and the thermally conductive block to apart them.   
     
     
         20 . A handler apparatus, comprising
 a robot hand that transports an electronic component:   a heat sink that radiates heat of the electronic component:   a thermally conductive block placed opposed the heat sink so as to be brought in contact with or apart from the heat sink;   a compressed air feeding circuit for feeding compressed air to a gap between facing surfaces of the heat sink and the thermally conductive block to apart them.