Heat dissipation device

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

1 . A heat dissipation device comprising:
 a first base;   a second base attached on the first base;   a fin set attached on the second base;   a first heat pipe comprising a first evaporating section sandwiched between the first base and the second base, two first condensing sections sandwiched between the second base and the fin set, and two first connecting sections respectively interconnecting the first evaporating section and the first condensing sections; and   a second heat pipe comprising a second evaporating section sandwiched between the first base and the second base, a second condensing section inserted into the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein a plurality of first receiving grooves are defined in a top face of the first base, and the first evaporating section and the second evaporating section are respectively received in the first receiving grooves. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein a top face of the first evaporating section is coplanar with a top face of the second evaporating section and the top face of the first base. 
     
     
         4 . The heat dissipation device of  claim 1 , wherein two second receiving grooves are defined in a bottom face of the fin set, and the first condensing sections are respectively received in the second receiving grooves. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein bottom faces of the condensing sections are coplanar with a bottom face of the fin set. 
     
     
         6 . The heat dissipation device of  claim 1 , wherein two first recessed portions are defined in a top face of the first base, two first cutouts are defined in the second base, two second recessed portions are defined in a bottom face of the fin set, and the first recessed portions correspondingly communicated with the first cutouts and the second recessed portions, thereby forming two receiving space. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein each first connecting section is accommodated in a corresponding receiving space. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein a through hole is defined in the fin set for receiving the second condensing section therein, and the through hole extends transversely through the fin set. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein the through hole is located adjacent a top end of the fin set. 
     
     
         10 . The heat dissipation device of  claim 8 , wherein a receiving slot is defined at a lateral side of the fin set for accommodating the second connecting section therein, and the receiving slot extends from a bottom face of the fin set to the through hole 
     
     
         11 . The heat dissipation device of  claim 1 , wherein an area of the second base is larger than that of the first base. 
     
     
         12 . The heat dissipation device of  claim 11 , wherein the first base and the second base are both rectangular, and a width of the second base is equal to a length of the first base. 
     
     
         13 . The heat dissipation device of  claim 1 , wherein the first heat pipe is S-shaped, the first evaporating section is parallel to the first condensing sections, and the two first condensing sections are respectively located at two opposite lateral sides of the first evaporating section. 
     
     
         14 . The heat dissipation device of  claim 1 , wherein the second heat pipe is U-shaped, and the second evaporating section is parallel to the second condensing section. 
     
     
         15 . The heat dissipation device of  claim 1 , wherein the fin set comprises a plurality of parallel fins engaging with each other. 
     
     
         16 . A heat dissipation device comprising:
 a first base;   a second base attached on the first base;   a fin set attached on the second base;   a first heat pipe comprising a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section; and   a second heat pipe comprising a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.   
     
     
         17 . The heat dissipation device of  claim 16 , wherein the second evaporating section is sandwiched between the first base and the second base. 
     
     
         18 . The heat dissipation device of  claim 17 , wherein a plurality of first receiving grooves are defined in a top face of the first base, and the first evaporating section and the second evaporating section are respectively received in the first receiving grooves. 
     
     
         19 . The heat dissipation device of  claim 16 , wherein a second receiving groove is defined in a bottom face of the fin set, and the first condensing section is received in the second receiving groove. 
     
     
         20 . The heat dissipation device of  claim 16 , wherein a through hole is defined in the fin set for receiving the second condensing section therein, and the through hole extends transversely through the fin set.