US2012319130A1PendingUtilityA1
Light emitting device and method of fabricating the same
Est. expiryJun 25, 2027(~0.9 yrs left)· nominal 20-yr term from priority
H10H 20/812H10H 20/825
56
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Provided are a light emitting device and a method of fabricating the same. The light emitting device comprises: a first conductive semiconductor layer; an active layer comprising an InGaN well layer and a GaN barrier layer on the first conductive semiconductor layer; and a second conductive semiconductor layer on the active layer. The GaN barrier layer comprises an AlGaN layer.
Claims
exact text as granted — not AI-modified1 . A light emitting device comprising:
a first conductive semiconductor layer; an active layer on the first conductive semiconductor layer; and a second conductive semiconductor layer on the active layer, wherein the active layer comprises a plurality of structures including an InGaN well layer, a first GaN barrier layer on the InGaN well layer, an AlGaN layer on the first GaN barrier layer, and a second GaN barrier layer on the AlGaN layer, and wherein the second GaN barrier layer has less pits than the first GaN barrier layer thereof.
2 . The light emitting device according to claim 1 , wherein the AlGaN layer is directly inter disposed between the first GaN barrier layer and the second GaN barrier layer.
3 . The light emitting device according to claim 1 , wherein the AlGaN layer is thicker than the first GaN barrier layer.
4 . The light emitting device according to claim 1 , wherein the AlGaN layer is thicker than the second GaN barrier layer.
5 . The light emitting device according to claim 1 , wherein the AlGaN layer is thicker than both the first GaN barrier layer and the second GaN barrier layer.
6 . The light emitting device according to claim 1 , wherein each of the plurality of structures has sequentially and directly stacked the InGaN well layer, the first GaN barrier layer, the AlGaN layer, and the second GaN barrier layer.
7 . The light emitting device according to claim 1 , wherein the AlGaN layer is formed with a thickness of 5.18 Å to 15.54 Å.
8 . The light emitting device according to claim 1 , wherein the AlGaN layer has a thickness of one to three mono layers.
9 . The light emitting device according to claim 1 , wherein the AlGaN layer is expressed as Al x Ga 1-x N (0.1≦×≦0.5).
10 . The light emitting device according to claim 1 , wherein the AlGaN layer is formed in the GaN barrier layer, and a top and a bottom of the AlGaN layer directly contact the second and first portions of the GaN barrier layer, respectively.
11 . The light emitting device according to claim 1 , wherein the AlGaN layer is formed by directly contacting the first GaN barrier layer.
12 . The light emitting device according to claim 1 , wherein the second GaN barrier layer is formed by directly contacting the AlGaN layer.Join the waitlist — get patent alerts
Track US2012319130A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.