US2012320540A1PendingUtilityA1

Printed circuit board and manufacturing method therefor

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Assignee: DAIKUHARA OSAMUPriority: Jul 22, 2005Filed: Aug 28, 2012Published: Dec 20, 2012
Est. expiryJul 22, 2025(expired)· nominal 20-yr term from priority
H05K 3/429Y10T29/49117H05K 3/0047H05K 2203/0207H05K 3/242H05K 2203/175H05K 2201/0919Y10T29/49165H05K 1/117Y10T29/49155H05K 2201/0949
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Claims

Abstract

A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.

Claims

exact text as granted — not AI-modified
1 . A printed circuit board of a card edge connector type comprising:
 two interconnections formed in parallel on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate; and   a connecting terminal-forming wiring being commonly in connection with the two interconnections, when the connecting terminals are formed by the electrolytic plating,   wherein the two interconnections are electrically isolated from the connecting terminal-forming wiring by a process opening formed in the substrate, the process opening being commonly connected to the two interconnections.   
     
     
         2 . The printed circuit board as claimed in  claim 1 , wherein the connecting terminal-forming wirings are formed as inner layers of the substrate, and are isolated from the interconnections by the process opening that extends to a given depth in the substrate.

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