Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays

Abstract

The invention teaches novel structure and methods for producing electrical current collectors and electrical interconnection structure. Such articles find particular use in facile production of modular arrays of photovoltaic cells. The current collector and interconnecting structures may be initially produced separately from the photovoltaic cells thereby allowing the use of unique materials and manufacture. Subsequent combination of the structures with photovoltaic cells allows facile and efficient completion of modular arrays. Methods for combining the collector and interconnection structures with cells and final interconnecting into modular arrays are taught.

1 . A method of manufacture of an article combining photovoltaic cell structure and a conductive material pattern suitable for collecting current from a light incident surface of a photovoltaic cell, said method comprising the steps of,
 providing photovoltaic cell structure having a top light incident surface and comprising semiconductor material,   providing a flexible structure comprising a conductive material pattern positioned on a polymer based sheet, said flexible structure being manufactured absent said cell structure,   combining a first portion of said flexible structure and said cell structure such that a portion of said pattern contacts said top light incident surface and said pattern is distributed over a preponderance of said top light incident surface, and   removing a portion of said polymer based sheet while said pattern remains distributed over a preponderance of said top light incident surface.   
     
     
         2 . The method of  claim 1  wherein said photovoltaic cell structure further comprises a self supporting metal based foil 
     
     
         3 . The method of  claim 1  wherein said top light incident surface comprises a transparent conductive material. 
     
     
         4 . The method of  claim 3  wherein said transparent conductive material comprises a metal oxide. 
     
     
         5 . The method of  claim 1  wherein said cell structure is provided to said combining step as a continuous form. 
     
     
         6 . The method of  claim 1  wherein said flexible structure is provided to said combining step as a continuous form. 
     
     
         7 . The method of  claim 1  wherein said pattern comprises a common monolithic material extending throughout all of said pattern. 
     
     
         8 . The method of  claim 1  wherein said pattern is ohmically joined to additional conductive material positioned outside the terminal edge of said cell structure such that conductive material crosses said terminal edge. 
     
     
         9 . The method of  claim 8  wherein said pattern and said additional conductive material both comprise a common monolithic material extending throughout all of said pattern. 
     
     
         10 . The method of  claim 1  wherein portions of exposed surfaces of said pattern are formed by a metal based material, said metal based material being absent a polymeric binder material. 
     
     
         11 . The method of  claim 10  wherein said metal based material comprises nickel. 
     
     
         12 . The method of  claim 10  wherein said metal based material comprises a low melting point metal based material which can melt during a process of laminating said flexible structure to said photovoltaic cell structure. 
     
     
         13 . The process of  claim 12  wherein said low melting point metal based material comprises indium. 
     
     
         14 . The process of  claim 1  wherein said pattern comprises a monolithic metal based material extending over substantially the entirety of said continuous form. 
     
     
         15 . The method of  claim 1  wherein said combination article is accumulated on a roll following said step of removing said portion of said polymer based sheet. 
     
     
         16 . The method of  claim 1  wherein said combining step comprises laminating said flexible structure to said top light incident surface. 
     
     
         17 . The method of  claim 1  wherein portions of exposed surfaces of said pattern comprise an electrically conductive polymer. 
     
     
         18 . The method of  claim 1  wherein portions of exposed surfaces of said pattern comprise an adhesive exhibiting adhesive affinity for said top light incident surface. 
     
     
         19 . The method of  claim 18  wherein said adhesive is characterized as a conductive adhesive. 
     
     
         20 . The method of  claim 1  wherein portions of said pattern are defined by printed material and wherein said printed material is further overlayed by metal based material.