Heat dissipation system

Abstract

A heat dissipation system for a computer enclosure comprises a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard; a front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate; and an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.

1 . A heat dissipation system for a computer enclosure, comprising:
 a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard;   a front plate perpendicular to the base plate; the front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate adjacent to the front plate; and   an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein   airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.   
     
     
         2 . The heat dissipation system of  claim 1 , further comprising a first side plate perpendicular to the base plate, and a back plate perpendicular to the first side plate; the first side plate defining a plurality of first air inlet holes aligned with the first air inlet opening; the back plate defining a plurality of second air inlet holes aligned with the second air inlet opening; and the air guiding device is adapted to guide airflow from outside of the computer enclosure via the plurality of first air inlet holes and the plurality of second air inlet holes. 
     
     
         3 . The heat dissipation system of  claim 1 , wherein the first air outlet opening and the second air outlet opening are aligned with the first heat-generating component; and the third air outlet opening is aligned with the second heat-generating component. 
     
     
         4 . The heat dissipation system of  claim 1 , wherein a first fan is fixed in the first heat-generating component; a second fan is fixed in the second air outlet opening; and a third fan is fixed in the third air outlet opening. 
     
     
         5 . The heat dissipation system of  claim 2 , further comprising a second side plate perpendicular to the base plate and opposite to the first side plate; the second side plate defines a plurality of third air inlet holes thereon; and the air guiding device defines a third air inlet opening aligned with the plurality of third air inlet holes. 
     
     
         6 . The heat dissipation system of  claim 5 , wherein each of the first air inlet opening, the second air inlet opening, and the third air inlet opening has an air deflecting member fixed therein; the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket; the bracket comprises a first surface; and a plurality of bending portions extending from the first surface for accommodating the conductive foam piece therebetween. 
     
     
         7 . The heat dissipation system of  claim 6 , wherein the bracket further comprises a second surface; and a handle extends from the second surface for slidably fixing the brackets in each of the first air inlet opening, the second air inlet opening and the third air inlet opening. 
     
     
         8 . The heat dissipation system of  claim 7 , wherein the air guiding device comprises a bottom wall, a front wall, and a back wall perpendicular to the bottom wall; the first air inlet opening and the third air inlet opening are defined between the front wall and the back wall; and the second air inlet opening is defined on the back wall. 
     
     
         9 . The heat dissipation system of  claim 7 , wherein a plurality of parallel guiding portions are mounted on two sides of each of the first air inlet opening, the second air inlet opening, and the third air inlet opening; and the brackets are slid along the plurality of parallel guiding portions into each of the first air inlet opening, the second air inlet opening, and the third air inlet opening. 
     
     
         10 . The heat dissipation system of  claim 9 , wherein a distance between two adjacent pluralities of parallel guiding portions is equal to a width of the bracket. 
     
     
         11 . A heat dissipation system for a computer enclosure, comprising:
 a base plate having a motherboard mounted thereon; and a first heat-generating component is mounted on the motherboard;   a front plate perpendicular to the base plate; the front plate defines a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate adjacent to the front plate; and   an air guiding device mounted on the first heat-generating component; the air guiding device defines a first air inlet opening, a second air inlet opening, and a first air outlet opening thereon; each of the first air inlet opening and the second air inlet opening has an air deflecting member fixed therein; and the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket, wherein   the air guiding device is adapted to guide airflow from outside of the computer enclosure via the first air inlet opening and the second air inlet opening, and direct the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening and out of the computer enclosure via the second air outlet opening and the third air outlet opening.   
     
     
         12 . The heat dissipation system of  claim 11 , further comprising a first side plate perpendicular to the base plate, and a back plate perpendicular to the first side plate; the first side plate defines a plurality of first air inlet holes aligned with the first air inlet opening; the back plate defines a plurality of second air inlet holes aligned with the second air inlet opening; and the air guiding device is adapted to guide airflow from outside of the computer enclosure via the plurality of first air inlet holes and the plurality of second air inlet holes. 
     
     
         13 . The heat dissipation system of  claim 11 , wherein the first air outlet opening and the second air outlet opening are aligned with the first heat-generating component; and the third air outlet opening is aligned with the second heat-generating component. 
     
     
         14 . The heat dissipation system of  claim 11 , wherein a first fan is fixed on the first heat-generating component; a second fan is fixed on the second air outlet opening; and a third fan is fixed on the third air outlet opening. 
     
     
         15 . The heat dissipation system of  claim 12 , further comprising a second side plate perpendicular to the base plate and opposite to the first side plate; the second side plate defines a plurality of third air inlet holes thereon; and the air guiding device defines a third air inlet opening aligned with the plurality of third air inlet holes. 
     
     
         16 . The heat dissipation system of  claim 15 , wherein the air deflecting member comprises a bracket and a conductive foam piece fixed on the bracket; the bracket comprises a first surface; and a plurality of bending portions extending from the first surface for accommodating the conductive foam piece therebetween. 
     
     
         17 . The heat dissipation system of  claim 16 , wherein the bracket further comprises a second surface; and a handle extends from the second surface for slidably fixing the brackets in each of the first air inlet opening, the second air inlet opening and the third air inlet opening. 
     
     
         18 . The heat dissipation system of  claim 17 , wherein the air guiding device comprises a bottom wall, a front wall and a back wall perpendicular to the bottom wall; the first air inlet opening and the third air inlet opening are between the front wall and the back wall; and the second air inlet opening is on the back wall. 
     
     
         19 . The heat dissipation system of  claim 17 , wherein a plurality of parallel guiding portions are mounted on two sides of each of the first air inlet opening, the second air inlet opening and the third air inlet opening; and the brackets are slid along the plurality of parallel guiding portions into each of the first air inlet opening, the second air inlet opening, and the third air inlet opening. 
     
     
         20 . The heat dissipation system of  claim 19 , wherein a distance between two adjacent pluralities of parallel guiding portions is equal to a width of the conductive foam piece.