US2012325664A1PendingUtilityA1
Nanosensor and method of manufacturing the same
Est. expiryJun 22, 2031(~4.9 yrs left)· nominal 20-yr term from priority
C12Q 1/6869G01N 33/48721C12Q 1/6825G01N 27/44791
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Claims
Abstract
A nanosensor comprising a substrate having a hole; a first insulating layer disposed on the substrate and having a first nanopore at a location corresponding to the hole in the substrate; first and second electrodes disposed on the first insulating layer, wherein the first and second electrodes are spaced apart from each other with the first nanopore positioned therebetween; a first electrode pad disposed on at least a portion of the first electrode; a second electrode pad disposed on at least a portion of the second electrode; and a protective layer disposed on at least a portion of the first and second electrode pads; as well as a method for manufacturing same.
Claims
exact text as granted — not AI-modified1 . A nanosensor comprising:
a substrate having a hole; a first insulating layer disposed on the substrate and having a first nanopore at a location corresponding to the hole in the substrate; first and second electrodes disposed on the first insulating layer, wherein the first and second electrodes are spaced apart from each other with the first nanopore positioned therebetween; a first electrode pad disposed on at least a portion of the first electrode; a second electrode pad disposed on at least a portion of the second electrode; and a protective layer disposed on at least a portion of the first and second electrode pads.
2 . The nanosensor of claim 1 , wherein the protective layer covers only a portion of each of the first and second electrode pads, and the first and second electrode pads cover only a portion of the first and second electrodes, respectively.
3 . The nanosensor of claim 1 , further comprising:
a second insulating layer disposed on the protective layer and having a second nanopore connected to the first nanopore.
4 . The nanosensor of claim 3 , wherein the second insulating layer covers the protective layer and portions of the first and second electrodes adjacent the nanopore.
5 . The nanosensor of claim 1 , wherein the first and second electrodes comprise graphene or carbon nanotubes.
6 . The nanosensor of claim 3 , wherein at least one of the first insulating layer and the second insulating layer comprises a nitride.
7 . The nanosensor of claim 1 , wherein the protective layer comprises an oxide.
8 . A method of manufacturing a nanosensor, the method comprising:
forming a first insulating layer on a surface of a substrate; forming graphene on the first insulating layer; forming a metal layer on the graphene; patterning the metal layer and the graphene; exposing a portion of the graphene by again patterning the metal layer; forming a protective layer on the exposed portion of the graphene and the metal layer; removing a portion of the protective layer to expose a portion of the graphene disposed under the protective layer; forming a hole in the substrate; and forming a first nanopore in the first insulating layer and the exposed portion of the graphene, wherein the first nanopore is connected to the hole.
9 . The method of claim 8 , wherein forming graphene on the first insulating layer comprises:
forming a catalyst layer on the first insulating layer; and growing graphene on the catalyst layer.
10 . The method of claim 8 , further comprising, after removing a portion of the protective layer to expose a portion of the graphene:
forming a second insulating layer on the exposed portion of the graphene and the remaining protective layer.
11 . The method of claim 10 , further comprising:
forming a second nanopore in the second insulating layer, wherein the second nanopore is connected to the first nanopore.
12 . The method of claim 11 , wherein the first nanopore and the second nanopore are formed simultaneously.
13 . The method of claim 8 , wherein the metal layer and the graphene are patterned into shapes resembling bow ties.
14 . The method of claim 10 , further comprising:
exposing an edge portion of the metal layer by etching a portion of the second insulating layer and the protective layer.
15 . The method of claim 10 , wherein at least one of the first insulating layer, the second insulating layer, and the protective layer is formed by low-pressure chemical vapor deposition (LPCVD).
16 . The method of claim 10 , wherein at least one of the first insulating layer and the second insulating layer is formed at a temperature of at least 500° C. but not exceeding 1000° C.
17 . The method of claim 8 , wherein the protective layer is formed at a temperature of at least 300° C. but not exceeding 500° C.
18 . A method of manufacturing a nanosensor, the method comprising:
forming a first insulating layer on a surface of a substrate; forming graphene on the first insulating layer; patterning the graphene; forming a sacrificial layer on the graphene; exposing a first portion of the graphene by patterning the sacrificial layer; forming a second insulating layer on the first portion of the graphene and the sacrificial layer; forming a photoresist layer on a portion of the second insulating layer and removing a remaining portion of the second insulating layer; exposing a second portion of the graphene by removing the sacrificial layer; forming a metal layer on the photoresist layer and the second portion of the graphene; removing the photoresist layer; forming a hole in the substrate; and forming a nanopore in the first insulating layer, the graphene, and the second insulating layer, wherein the nanopore is connected to the hole.
19 . The method of claim 18 , wherein forming graphene on the first insulating layer comprises transferring graphene grown on an auxiliary substrate from the auxiliary substrate to the first insulating layer.
20 . The method of claim 18 , wherein the metal layer and the graphene are patterned into shapes resembling bow ties.
21 . The method of claim 18 , wherein at least one of the first insulating layer and the second insulating layer comprises a nitride.
22 . The method of claim 18 , wherein the sacrificial layer comprises an oxide.
23 . The method of claim 18 , wherein at least one of the first insulating layer, the second insulating layer, and the sacrificial layer is formed by low-pressure chemical vapor deposition (LPCVD).
24 . The method of claim 23 , wherein at least one of the first insulating layer and the second insulating layer is formed at a temperature of at least 500° C. but not exceeding 1000° C.
25 . The method of claim 23 , wherein the sacrificial layer is formed at a temperature of at least 300° C. but not exceeding 500° C.Cited by (0)
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