Method of fabricating a layered ceramic substrate

Abstract

A method of fabricating a mounting substrate for an inkjet printhead, the method includes providing a plurality of layers of unfired ceramic, wherein a first layer and a second layer of the plurality of layers are each patterned to have unfired ceramic in one region and no unfired ceramic in a second region; stacking the plurality of layers in a predetermined order; and firing the stack of layers to make a co-fired ceramic substrate including a first ink channel corresponding to the first layer and a second ink channel corresponding to the second layer.

1 . A method of fabricating a mounting substrate for an inkjet printhead, the method comprising:
 providing a plurality of layers of unfired ceramic, wherein a first layer and a second layer of the plurality of layers are each patterned to have unfired ceramic in one region and no unfired ceramic in a second region;   stacking the plurality of layers in a predetermined order; and   firing the stack of layers to make a co-fired ceramic substrate including a first ink channel corresponding to the first layer and a second ink channel corresponding to the second layer.   
     
     
         2 . The method according to  claim 1  further comprising grinding a surface of the co-fired ceramic substrate. 
     
     
         3 . The method according to  claim 2 , wherein the surface defines a first ink channel opening corresponding to the first layer, and a second ink channel opening corresponding to the second layer. 
     
     
         4 . The method according to  claim 1 , the plurality of layers being configured as panels including multiple substantially identical parts. 
     
     
         5 . The method according to  claim 4  further comprising separating the multiple substantially identical parts after firing the stack of layers. 
     
     
         6 . The method according to  claim 1 , wherein providing the plurality of layers further comprises tape casting the layers from ceramic slurry. 
     
     
         7 . The method according to  claim 1 , wherein patterning the first layer and the second layer further comprises laser cutting the first layer and the second layer. 
     
     
         8 . The method according to  claim 1 , wherein patterning the first layer and the second layer further comprises punching the first layer and the second layer. 
     
     
         9 . The method according to  claim 1  further comprising insert molding the co-fired substrate to provide alignment features for the mounting substrate, the alignment features being formed in plastic. 
     
     
         10 . A method of making an inkjet printhead comprising:
 providing a plurality of layers of unfired ceramic, wherein a first layer and a second layer of the plurality of layers are each patterned to have unfired ceramic in one region and no unfired ceramic in a second region;   stacking the plurality of layers in a predetermined order; and   firing the stack of layers to make a co-fired ceramic substrate, wherein a surface of the mounting substrate defines a first ink channel opening corresponding to the first layer, and a second ink channel opening corresponding to the second layer;   providing a printhead die including a first nozzle array that is configured to be fed with ink by a first ink feed, and a second nozzle array that is configured to be fed with ink by a second ink feed; and attaching the printhead die to the surface of the mounting substrate so that the first ink feed is fluidically connected to the first ink channel opening and the second ink feed is fluidically connected to the second ink channel opening.   
     
     
         11 . The method according to  claim 10  further comprising grinding a surface of the co-fired ceramic substrate before attaching the printhead die. 
     
     
         12 . The method according to  claim 10 , wherein attaching the printhead die further comprises:
 applying an adhesive to the surface of the mounting substrate;   aligning the printhead die; and   curing the adhesive.   
     
     
         13 . The method according to  claim 12 , wherein the cured adhesive provides a seal that extends around the first ink channel opening and the second ink channel opening. 
     
     
         14 . The method according to  claim 10 , the plurality of layers being configured as panels including multiple substantially identical parts. 
     
     
         15 . The method according to  claim 14  further comprising separating the multiple substantially identical parts after firing the stack of layers. 
     
     
         16 . The method according to  claim 10 , wherein providing the plurality of layers further comprises tape casting the layers from ceramic slurry. 
     
     
         17 . The method according to  claim 10 , wherein patterning the first layer and the second layer further comprises laser cutting the first layer and the second layer. 
     
     
         18 . The method according to  claim 10 , wherein patterning the first layer and the second layer further comprises punching the first layer and the second layer. 
     
     
         19 . The method according to  claim 10  further comprising insert molding the co-fired substrate to provide alignment features for the mounting substrate, the alignment features being formed in plastic. 
     
     
         20 . The method according to  claim 19 , wherein attaching the printhead die further comprises:
 applying an adhesive to the surface of the mounting substrate;   aligning the printhead die to the alignment features formed in plastic; and   curing the adhesive.