Multichip package structure and method of manufacturing the same

Abstract

A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

1 . A multichip package structure, comprising:
 a substrate unit including a substrate body;   a light-emitting unit including a plurality of light-emitting chips disposed on the substrate body and electrically connected to the substrate body;   a frame unit including a semidrying surrounding light-reflecting frame surroundingly disposed on the substrate body, wherein the light-emitting chips are surrounded by the semidrying surrounding light-reflecting frame, and the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and   a package unit including a package colloid body disposed on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.   
     
     
         2 . The multichip package structure of  claim 1 , wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof. 
     
     
         3 . The multichip package structure of  claim 1 , wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same. 
     
     
         4 . The multichip package structure of  claim 1 , wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid. 
     
     
         5 . The multichip package structure of  claim 1 , wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads. 
     
     
         6 . The multichip package structure of  claim 5 , wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads. 
     
     
         7 . A method of manufacturing a multichip package structure, comprising the steps of:
 providing a substrate body;   placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body;   surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips;   naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and   forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.   
     
     
         8 . The method of  claim 7 , wherein after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame. 
     
     
         9 . The method of  claim 7 , wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof. 
     
     
         10 . The method of  claim 7 , wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same. 
     
     
         11 . The method of  claim 7 , wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid. 
     
     
         12 . The method of  claim 7 , wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads. 
     
     
         13 . The method of  claim 12 , wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads. 
     
     
         14 . A method of manufacturing a multichip package structure, comprising the steps of:
 providing a substrate body;   surroundingly forming surrounding liquid colloid on the substrate body;   naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body;   placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body and surrounded by the semidrying surrounding light-reflecting frame; and   forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.   
     
     
         15 . The method of  claim 14 , wherein after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame. 
     
     
         16 . The method of  claim 14 , wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof. 
     
     
         17 . The method of  claim 14 , wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same. 
     
     
         18 . The method of  claim 14 , wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid. 
     
     
         19 . The method of  claim 14 , wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads. 
     
     
         20 . The method of  claim 19 , wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads.