Versatile workpiece refining

Abstract

Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.

1 - 25 . (canceled) 
     
     
         26 . A method for finishing a semiconductor wafer, comprising:
 applying a finishing surface of a finishing element to a layer disposed on a semiconductor wafer;   during the application of the finishing surface of the finishing element to the layer, effecting relative motion between the finishing surface of the finishing element and the semiconductor wafer through a coupling between a driving element and the finishing element, the driving element being displaced relative to a holder for the semiconductor wafer through a driving mechanism; and   controlling application of the finishing surface of the finishing element to the layer and a path of the relative motion of the between the finishing surface of the finishing element and the semiconductor wafer via a control system that includes a plurality of in situ semiconductor wafer finishing sensors for providing finishing information for said control system.   
     
     
         27 . The method of  claim 26 , wherein the relative motion between the finishing surface of the finishing element and the semiconductor wafer is effected through a non-contact coupling between a driving element and the finishing element when the driving element is displaced relative to the holder for the semiconductor wafer. 
     
     
         28 . The method of  claim 26 , wherein the finishing element includes a magnetically responsive member and the relative motion between the finishing surface of the finishing element and the semiconductor wafer is effected through a magnetic coupling between a driving element and the finishing element when the driving element is displaced relative to the holder for the semiconductor wafer. 
     
     
         29 . The method of  claim 28 , wherein controlling the application of the finishing surface comprises controlling a strength of magnetic coupling between the finishing element and the driving element. 
     
     
         30 . The method of  claim 26 , wherein said in situ semiconductor wafer finishing sensors are free of physical contact with the semiconductor wafer and the layer being finished, and information provided by said in situ semiconductor wafer finishing sensors include information relevant for one or more process control parameters of a finishing process control model for said semiconductor wafer. 
     
     
         31 . The method of  claim 26 , wherein application of the finishing surface of the finishing element to the layer is performed in the presence of a finishing composition introduced between the finishing surface of the finishing element and the layer. 
     
     
         32 . A method of refining a workpiece, comprising:
 applying a first finishing surface of a first finishing element to a first layer of the workpiece;   sensing in situ process information for the first layer of the workpiece with a plurality of operative sensors, determining a change in a value of at least one first layer process control parameter using the in situ process information for the first layer, and controlling application of the first finishing surface of the first finishing element to the first layer with an operative controller responsive to the change in the value of the first layer process control parameter;   applying a second finishing surface of a second finishing element to a second layer of the workpiece; and   sensing in situ process information for the second layer of the workpiece with the plurality of operative sensors, determining a change in a value of at least one second layer process control parameter using the in situ process information for the second layer of the workpiece, and controlling application of the second finishing surface of the second finishing element to the second layer with the operative controller,   wherein the first layer process control parameter and the second layer process control parameter are defined parameters of a process model for refining the workpiece.   
     
     
         33 . The method according to  claim 32 , wherein at least one of applying the first finishing surface and applying the second finishing surface comprises applying a finishing surface in the presence of a finishing compound. 
     
     
         34 . The method according to  claim 32 , wherein the process model comprises a process model for feedforward control of the finishing elements. 
     
     
         35 . The method according to  claim 32 , wherein the process model comprises a process model for feedback control of the finishing elements. 
     
     
         36 . The method according to  claim 32 , wherein during the application of at least one of the first and second finishing surfaces, relative motion between a respective at least one of the first finishing element and second finishing element and the workpiece is effected through a magnetic coupling between a driving element and the respective first or second finishing element, the driving element being displaced relative to a holder for the workpiece through a driving mechanism and the respective first or second finishing element includes a magnetically responsive member. 
     
     
         37 . The method according to  claim 32 , wherein during the application of both of the first and second finishing surfaces, relative motion between each respective first finishing element and second finishing element and the workpiece is effected through a magnetic coupling between a driving element and the respective first and second finishing element, the driving element being displaced relative to a holder for the workpiece through a driving mechanism and each respective first and second finishing element includes a magnetically responsive member. 
     
     
         38 . The method of  claim 32 , wherein the applications of the respective first and second finishing surfaces to the respective first and second layers are effected using different operative motions of the respective first and second finishing surfaces with respect to the workpiece. 
     
     
         39 . The method of  claim 38 , wherein the different operative motions comprise motions having different paths. 
     
     
         40 . The method of  claim 38 , wherein the different operative motions comprise motions having different cycle times. 
     
     
         41 . The method of  claim 38 , wherein the different operative motions comprise motions having different application pressures for the respective first and second finishing surfaces to the respective first and second layers. 
     
     
         42 . The method of  claim 38 , wherein the different operative motions comprise motions having different relative velocities of the respective first and second finishing surfaces to the workpiece. 
     
     
         43 . The method of  claim 32 , wherein the plurality of operative sensors comprise at least one non-contact sensor and the non-contact sensor emits radiation that interacts with the workpiece in order to sense values information relevant for at least one of the parameters of the process model.