Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same

Abstract

To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.

1 . A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising polycondensating a polysiloxane oligomerconsisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
 the curable organopolysiloxane composition containing a component having a molecular weight of 800 or smaller at a proportion of, in areal ratio of GPC, 10% or less.   
     
     
         2 . The method according to  claim 1 , wherein the material to be polycondensated in the polycondensating includes the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger at 50 wt % or more to the total weight of the material. 
     
     
         3 . The method according to  claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polysiloxane consisting only of bifunctional silicon and having silanols at the both terminals. 
     
     
         4 . The method according to  claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polydimethylsiloxane having silanols at the both terminals. 
     
     
         5 . The method according to  claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a diphenylsiloxane-dimethylsiloxane copolymer having silanols at the both terminals. 
     
     
         6 . The method according to  claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polydiphenylsiloxane having silanols at the both terminals. 
     
     
         7 . The method according to  claim 1 , wherein the polycondensating uses an organometallic compound catalyst. 
     
     
         8 . The method according to  claim 1 , further comprising,
 after the polycondensating, distilling the solvent.   
     
     
         9 . The method according to  claim 1 , further comprising,
 after the polycondensating, mixing inorganic particle.   
     
     
         10 . The method according to  claim 1 , further comprising,
 after the polycondensating, adding phosphor particle.   
     
     
         11 . A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising:
 polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends with a silane monomer comprising tri- or more functional silicon and having an alkoxy group or with a polysiloxane oligomer containing tri- or more functional silicon and having an alkoxy group; and   removing alcohol generated in the polycondensation, wherein   a ratio represented by {(the number of alkoxy groups)/(the number of silanols+the number of alkoxy groups)}×100(%) after the distilling is 0% or more and 50% or less.   
     
     
         12 . The method according to  claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydimethylsiloxane. 
     
     
         13 . The method according to  claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes a diphenylsiloxane-dimethylsiloxane copolymer. 
     
     
         14 . The method according to  claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydiphenylsiloxane. 
     
     
         15 . The method according to  claim 11 , wherein the polycondensating uses an organometallic compound catalyst. 
     
     
         16 . The method according to  claim 11 , further comprising,
 after the polycondensating, mixing inorganic particle.   
     
     
         17 . The method according to  claim 11 , further comprising,
 after the polycondensating, adding phosphor particle.   
     
     
         18 . A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the compound comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
 the curable organopolysiloxane composition containing a component having a molecular weight of 800 or smaller at a proportion of, in areal ratio of GPC, 10% or less.   
     
     
         19 . The curable organopolysiloxane composition according to  claim 18 , having a viscosity at 25° C. of 20 mPa·s or more and 1500 mPa·s or less. 
     
     
         20 . The curable organopolysiloxane composition according to  claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes polydimethylsiloxane. 
     
     
         21 . The curable organopolysiloxane composition according to  claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes diphenylsiloxane-dimethylsiloxane copolymer. 
     
     
         22 . The curable organopolysiloxane composition according to  claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes polydiphenylsiloxane. 
     
     
         23 . The curable organopolysiloxane composition according to  claim 18 , further comprising inorganic particle. 
     
     
         24 . The curable organopolysiloxane composition according to  claim 18 , further comprising phosphor particle. 
     
     
         25 . A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the curable organopolysiloxane composition comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends with a silane monomer comprising tri- or more functional silicon and having an alkoxy group or with a polysiloxane oligomer containing tri- or more functional silicon and having an alkoxy group, wherein the curable organopolysiloxane composition has a ratio represented by {(the number of alkoxy groups)/(the number of silanols+the number of alkoxy groups)}×100(%) of 0% or more and 50% or less. 
     
     
         26 . The curable organopolysiloxane composition according to  claim 25 , having a viscosity at 25° C. of 20 mPa·s or more and 1500 mPa·s or less. 
     
     
         27 . The curable organopolysiloxane composition according to  claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydimethylsiloxane. 
     
     
         28 . The curable organopolysiloxane composition according to  claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes diphenylsiloxane-dimethylsiloxane copolymer. 
     
     
         29 . The curable organopolysiloxane composition according to  claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydiphenylsiloxane. 
     
     
         30 . The curable organopolysiloxane composition according to  claim 25 , further comprising inorganic particle. 
     
     
         31 . The curable organopolysiloxane composition according to  claim 25 , further comprising phosphor particle. 
     
     
         32 . A method for producing a semiconductor device, the method comprising curing the curable organopolysiloxane composition defined in one of  claim 18 .