US2013043006A1PendingUtilityA1
Heat disspation device
Est. expiryAug 15, 2031(~5.1 yrs left)· nominal 20-yr term from priority
H10W 40/73H10W 40/43H10W 40/226F28D 15/0233F28D 15/0275
38
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Claims
Abstract
A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.
Claims
exact text as granted — not AI-modified1 . A heat dissipation device, comprising:
a substrate with a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively; a heat sink with a plurality of fins arranged on the cover; and a first heat pipe with an evaporation section, a condensation section, and a connection section interconnecting the evaporation section and the condensation section, the evaporation section being U-shaped and received in the receiving chamber, the connection section extending from the receiving chamber outward, the condensation section being inserted inside the heat sink and penetrating through the plurality of fins, the condensation section and the connecting section sitting in a common plane obliquely intersecting a plane where the U-shaped evaporation section sits.
2 . The heat dissipation device of claim 1 , wherein the condensation section of the first heat pipe sits right over the U-shaped evaporation section of the first heat pipe.
3 . The heat dissipation device of claim 1 , wherein the bottom plate comprises through holes defined at peripheral edge thereof, the cover and the supporter both comprising through holes defined corresponding to the through holes of the bottom plate, the bottom plate, the cover and the supporter capable being engaged together by connecting members each penetrating through a respective one of the through holes.
4 . The heat dissipation device of claim 3 , wherein the plurality of fins are arranged on the cover without sheltering the through holes of the cover.
5 . The heat dissipation device of claim 1 , wherein the cover defines a notch through which the connection section of the first heat pipe extends outward from the receiving chamber.
6 . The heat dissipation device of claim 1 , wherein the supporter includes two elongated shoulders arranged at two opposite peripheral sides of the bottom plate.
7 . The heat dissipation device of claim 1 , further comprising a second heat pipe with the same configuration of the first heat pipe, a U-shaped evaporation section of the second heat pipe being received in the receiving chamber, the U-shaped evaporation section of the second heat pipe having an opening direction opposite to the U-shaped evaporation section of the first heat pipe.
8 . The heat dissipation device of claim 7 , wherein the U-shaped evaporation sections of the first and second heat pipes sit adjacent to each other, the U-shaped evaporation section of the first heat pipe comprising a first end portion adjacent to the second heat pipe, the connection section of the first heat pipe extending from the first end portion, the U-shaped evaporation section of the second heat pipe comprising a second end portion adjacent to the first heat pipe, the connection section of the second heat pipe extending from the second end portion.
9 . The heat dissipation device of claim 1 , wherein the heat sink defines a through hole receiving the condensation section of the first heat pipe.
10 . The heat dissipation device of claim 1 , wherein a notch is defined at a lateral side of the heat sink receiving the connection section of the first heat pipe.
11 . The heat dissipation device of claim 1 , wherein the bottom plate includes two lateral walls extending upwardly from two opposite edges thereof, each lateral wall extending along a direction perpendicular to the bottom plate.
12 . The heat dissipation device of claim 11 , wherein the supporter includes two elongated shoulders arranged at two another two opposite edges of the bottom plate.
13 . The heat dissipation device of claim 12 , wherein the two shoulders each have two distal ends abutting against the two lateral walls.
14 . The heat dissipation device of claim 13 , wherein the two shoulders are parallel to each other and perpendicular to the lateral walls.Join the waitlist — get patent alerts
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