Integrated Circuit and Sensor for Imaging

Abstract

New sensors and different embodiments of multi-channel integrated circuit are provided. The new high energy and spatial resolution sensors use both solid state and scintillator detectors. Each channel of the readout chip employs low noise charge sensitive preamplifier(s) at its input followed by other circuitry. The different embodiments of the sensors and the integrated circuit are designed to produce high energy and/or spatial resolution two-dimensional and three-dimensional imaging for widely different applications. Some of these applications may require fast data acquisition, some others may need ultra high energy resolution, and a separate portion may require very high contrast. The embodiments described herein addresses all these issues and also other issues that may be useful in two and three dimensional medical and industrial imaging. The applications of the new sensors and integrated circuits addresses a broad range of applications such as medical and industrial imaging, NDE and NDI, security, baggage scanning, astrophysics, nuclear physics and medicine.

1 . A two-dimensional imaging sensor comprising:
 a first material that produces a signal in response to a particle, wherein a side of said first material contains a plurality of pixels;   a two-dimensional integrated circuit with a plurality of channels, wherein said plurality of channels are coupled to said plurality of pixels;   a processing circuit at least partially within at least one of said plurality of channels, wherein said processing circuit processes said signal;   a board with a side coupled to said two-dimensional integrated circuit; and   an output system that outputs an image using said processed signal.   
     
     
         2 . The sensor of  claim 1 , wherein said particles are selected from the group consisting of positrons, electrons, x-rays, gamma-rays and photons. 
     
     
         3 . The sensor of  claim 1 , further comprising a second material mounted side-by-side said first material to form a sensor array. 
     
     
         4 . The sensor of  claim 1 , further comprising a circuit board coupled to said output system that accumulates data from said output system. 
     
     
         5 . The sensor of  claim 1 , wherein said material is coupled to an opposing side of said side of said board coupled to said two-dimensional integrated circuit. 
     
     
         6 . A two-dimensional imaging sensor comprising:
 a first material responsive to particles that produces a signal;   a two-dimensional integrated circuit with a plurality of channels, wherein said first material is coupled to said two dimensional integrated circuit;   a processing circuit at least partially within at least one of said plurality of channels, wherein said processing circuit processes said signal;   a board having a side coupled to said two-dimensional integrated circuit; and   an output system that outputs an image using said processed signal.   
     
     
         7 . The sensor of  claim 6 , wherein said particles are selected from the group consisting of positrons, electrons, x-rays, gamma-rays and photons. 
     
     
         8 . The sensor of  claim 6 , further comprising a second material mounted side-by-side with said first material to form a sensor array. 
     
     
         9 . The sensor of  claim 6 , further comprising a circuit board coupled to said output system that aggregates data from said output system. 
     
     
         10 . The sensor of  claim 6 , wherein said first material is coupled to an opposing side to said side of said board coupled to said two-dimensional integrated circuit. 
     
     
         11 . A method of two-dimensional imaging using a pixel sensor comprising:
 producing a signal from a first material responsive to particles, wherein a side of said first material has a plurality of pixels;   coupling a two-dimensional integrated circuit with plurality of channels to said plurality of pixels;   processing said signal by using a circuit at least partially within at least one of said plurality of channels;   coupling said two-dimensional integrated circuit to a side of a board;   moving said pixel sensor to produce a time delayed integration (TDI) image; and   outputting said image through an output system.   
     
     
         12 . The method of  claim 11 , wherein said particles are selected from the group consisting of positrons, electrons, x-rays, gamma-rays and photons 
     
     
         13 . The method of  claim 11 , further comprising mounting a second material side by side with said first material to form a sensor array. 
     
     
         14 . The method of  claim 11 , further comprising coupling a circuit board to said output system; and aggregating data from said output system using said circuit board. 
     
     
         15 . The method of  claim 11 , further comprising coupling said first material to an opposing side to said side of said board coupled to said two-dimensional integrated circuit. 
     
     
         16 . A method of two-dimensional digital imaging using a pixel sensor comprising:
 producing a signal from a first material responsive to particles, wherein a side of said first material has a plurality of pixels;   coupling a two-dimensional integrated circuit with plurality of channels to said plurality of pixels;   counting said signal using a circuit at least partially within at least one of said plurality of channels;   coupling said two-dimensional integrated circuit on to a side of a board;   moving said pixel sensor to produce a time delayed integration (TDI) image; and   outputting said digital image through an output system.   
     
     
         17 . The method of  claim 15 , wherein said particles are selected from the group consisting of positrons, electrons, x-rays, gamma-rays and photons. 
     
     
         18 . The method of  claim 15 , further comprising mounting a second material side by side with said first material to form a sensor array. 
     
     
         19 . The method of  claim 15 , further comprising coupling said first material to an opposing side of said side of said board coupled to said two-dimensional integrated circuit. 
     
     
         20 . The method of  claim 15 , further comprising coupling a circuit board to said output system to aggregate data from said output system. 
     
     
         21 . A two-dimensional sensor comprising:
 a material responsive to a photon, wherein said photon produces a signal from an interaction through a Compton scatter or a photo electric effect inside said material, and wherein a side of said material has a plurality of pixels;   an integrated circuit with plurality of channels, wherein a portion of said plurality of channels are coupled to at least a portion of said plurality of pixels;   a processing circuit at least partially within said plurality of channels, wherein said processing circuit processes said signal;   a processing system coupled to said integrated circuit; and   an output system that outputs at least one of an energy, a position, and a direction information of said photon from said processing system.   
     
     
         22 . A hand-held detector comprising:
 an enclosure;   a display system;   a data processing system;   an output system; and   a two-dimensional sensor coupled to said data processing system; wherein said two dimensional sensor further comprises:
 a material responsive to a photon, wherein said photon produces a signal from an interaction through a Compton scatter or a photo electric effect inside said material, and wherein a side of said material has a plurality of pixels; 
 an integrated circuit with plurality of channels, wherein at least a portion of said plurality of channels are coupled to a portion of said plurality of pixels, and wherein said integrated circuit is coupled to said data processing system; and 
 a processing circuit at least partially within said plurality of channels, wherein said processing circuit processes said signal and outputs at least one of an energy, position, and direction information of said photon to said output system.