System in package, printed circuit board provided with such system in package

Abstract

System in package including a substrate having a first external layer including a first conductive patterned layer and being externally accessible for electrically connecting the system in package to an external electric circuit and a second internal layer including a second conductive patterned layer and being covered by the first layer and electronic devices provided on the substrate and electrically connected to external contact pads of the first conductive patterned layer. The devices and the first and second conductive patterned layer being electrically connected to form an internal electric circuit electronically connected to the external electric circuit, the first and the second layer being adjacently positioned, the electronic devices being enclosed in an overmould compound. At least one of the devices is electrically connected to at least one hidden contact pad of the second conductive patterned layer which is accessible after removal of a removable strip of the first layer.

1 - 14 . (canceled) 
     
     
         15 . Use of a system in package comprising a substrate having at least a first external layer comprising a first conductive patterned layer and being externally accessible for electrically connecting the system in package to an external electric circuit and a second internal layer comprising a second conductive patterned layer and being covered by the first layer and electronic devices provided on the substrate and electrically connected to external contact pads of the first conductive patterned layer, the devices and the first and the second conductive patterned layer being electrically connected such as to form an internal electric circuit provided to be electronically connected to the external electric circuit, the first and the second layer being adjacently positioned, the electronic devices being enclosed in an overmould compound, wherein at least one of the devices is electrically connected to at least one hidden contact pad of the second conductive patterned layer which is accessible after removal of a removable strip of the first layer, and wherein the strip is scratched away from, pulled away from, peeled off or chemically removed from the system in package. 
     
     
         16 . System in package comprising a substrate having at least a first external layer comprising a first conductive patterned layer and being externally accessible for electrically connecting the system in package to an external electric circuit and a second internal layer comprising a second conductive patterned layer and being covered by the first layer and electronic devices provided on the substrate and electrically connected to external contact pads of the first conductive patterned layer, the devices and the first and the second conductive patterned layer being electrically connected such as to form an internal electric circuit provided to be electronically connected to the external electric circuit, the first and the second layer being adjacently positioned, the electronic devices being enclosed in an overmould compound, wherein at least one of the devices is electrically connected to at least one hidden contact pad of the second conductive patterned layer which is accessible after removal of a removable strip of the first layer, and wherein the strip is provided to be peeled off the system in package. 
     
     
         17 . System in package according to  claim 16 , wherein the contact pads are conductive members provided to be in electrical contact with an external electric circuit and which are a conductive part of an electrically conductive path providing an electrical connection to one of the electronic devices of the system in package, the contact pad being located at an end part of the conductive path which is distal from an opposing end part of the conductive path providing an electrical connection to one of the electronic devices of the system in package. 
     
     
         18 . System in package according to  claim 16 , wherein the thickness of the strip and the thickness of the first layer are the same. 
     
     
         19 . System in package, according to  claim 15 , wherein the system in package is planar and in that the first layer is a top layer of the system in package. 
     
     
         20 . System in package according to  claim 15 , wherein the hidden contact pad is a debugging pad. 
     
     
         21 . System in package according to  claim 15 , wherein the removable strip is one of the external contact pads of the first layer having a different functionality from the hidden contact pad. 
     
     
         22 . System in package according to  claim 21 , wherein at least one of the devices is electrically connected to an additional hidden contact pad of the second layer which is accessible after removal of the removable strip of the first layer, the additional hidden contact pad having the same functionality as the external contact pad of the removable strip. 
     
     
         23 . System in package according to  claim 15 , wherein at least one of the external contact pads is a ground pad. 
     
     
         24 . System in package according to  claim 15 , wherein at least one of the external contact pads is a soldering pad having a predetermined size for heat dissipation. 
     
     
         25 . System in package according to  claim 15 , wherein at least one of the devices is an integrated circuit. 
     
     
         26 . System in package according to  claim 15 , wherein the substrate is a land grid array substrate. 
     
     
         27 . System in package according to  claim 15 , wherein the overmould compound is ceramic. 
     
     
         28 . Printed circuit board comprising a printed circuit board substrate on which an electric circuit is provided electrically connected to a system in package according to  claim 15 .