Heat dissipation device incorporating heat spreader

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.

1 . A heat dissipation device comprising:
 a heat spreader comprising a base for absorbing heat from a heat source, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board, a first chamber sealed being defined between the base and the partition board, and a second sealed chamber being defined between the partition board and the covering plate, the second chamber being remote from the base; and   a fin set placed on the heat spreader.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein a central portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein an empty zone is defined under a periphery of the base and surrounds the first chamber. 
     
     
         4 . The heat dissipation device of  claim 2 , wherein a central portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein an area of the first chamber is smaller than that of the second chamber. 
     
     
         6 . The heat dissipation device of  claim 4 , wherein a first wick structure is formed on an inner face of the first receiving portion. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure. 
     
     
         8 . The heat dissipation device of  claim 4 , wherein a fourth wick structure is formed on an inner face of the second receiving portion. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure. 
     
     
         10 . The heat dissipation device of  claim 1 , wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate working medium therein. 
     
     
         11 . The heat dissipation device of  claim 1 , wherein the second chamber is located above the first chamber. 
     
     
         12 . A heat spreader comprising:
 a base for absorbing heat from a heat source;   a partition board hermetically placed on the base, and a first chamber being defined between the base and the partition board; and   a covering plate hermetically placed on the partition board, a second chamber being defined between the partition board and the covering plate, and the second chamber being separated from the base by the partition board.   
     
     
         13 . The heat spreader of  claim 12 , wherein a center portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber. 
     
     
         14 . The heat spreader of  claim 13 , wherein a plurality of empty zones are defined at a bottom of the base and surround the first chamber. 
     
     
         15 . The heat spreader of  claim 13 , wherein a center portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber. 
     
     
         16 . The heat spreader of  claim 15 , wherein an area of the first chamber is smaller than that of the second chamber. 
     
     
         17 . The heat spreader of  claim 15 , wherein a first wick structure is formed on an inner face of the first receiving portion, a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure. 
     
     
         18 . The heat spreader of  claim 15 , wherein a fourth wick structure is formed on an inner face of the second receiving portion, a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure. 
     
     
         19 . The heat spreader of  claim 12 , wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate a working medium or fluid therein. 
     
     
         20 . A heat spreader comprising a base and a cover cooperatively defining a sealed space therein, a partition board being placed on the sealed base and dividing the sealed base into two separated chambers, each of the two separated chambers accommodating working medium therein.