Heat transfer bridge

Abstract

A heat transfer bridge for absorbing heat from electronic circuits and electrical distribution transformers to thereby cool said components is disclosed. The heat transfer bridge includes a passive pump for pumping a fluid having a low boiling point that readily creates bubbles when heated to its boiling point. The bubbles are directed via selected flow paths to effectively push or drive the fluid from adjacent a heat source such as an electronic circuit or transformer to heat dissipating components such as cooling fins. In one embodiment, the fluid in the inventive heat transfer bridge comprises a fluid comprising metallic slurry that provides many times the heat dissipation rate as compared to a clear fluid.

1 . A heat dissipation assembly for electronic and electrical components utilizing a liquid cycling heat transfer pump comprising:
 a) an elongated container;   b) a metal slurry fluid having a selectable boiling point contained in said container;   c) heat sink means thermally coupled to a first section of said container;   d) thermally coupling said heat source to provide heat energy to said fluid for generating in a second section of said container spaced fluid bubbles with hot fluid between said bubbles;   e) mounting said container to enable said bubbles to rise up said container;   f) said rising bubbles moving said fluid between the bubbles in the direction of the rising bubbles and toward said second section of said container wherein said heat sink means are positioned; and   h) said heat sink means removing heat energy from said fluid.   
     
     
         2 . A heat dissipation assembly for electronic and electrical components as in  claim 1  including,
 a) a closed tubular loop; 
 b) a fluid having a low boiling point contained in said tubular loop and flowable through said loop; 
 c) heat sink means thermally coupled to first sections of said loop; 
 d) thermally coupling said heat source to provide heat energy to said fluid for generating spaced fluid bubbles in a section of said tubular loop; 
 e) mounting said second section of said loop to enable said bubbles to rise up said second section of said tubular loop; 
 f) conforming the dimensions of said second section and the dimensions of said bubbles section to confine hot liquid in said spaces between rising bubbles; 
 g) said rising bubbles pushing and pumping said hot fluid through said second section of said loop toward said first section of said loop wherein said heat sink means are mounted; and 
 h) said heat sink means removing heat energy from said hot fluid. 
 
     
     
         3 . A heat dissipation assembly for electronic and electrical components as in  claim 1  including:
 a) a housing having heat concentrators for said assembly; 
 b) fluid retaining tubes within said assembly; 
 c) a fluid slurry comprising a fluid having a low boiling point and micro metallic particles contained within said assembly; 
 d) fluid pathways formed in said assembly; 
 e) means for mounting said housing adjacent a heat source; 
 f) said fluid forming bubbles when heated above said boiling point; 
 g) positioning at least one of said fluid pathways to direct said bubbles to move upwardly away from said heat source; 
 h) said bubbles pushing said slurry toward at least one heat concentrator to remove heat from said slurry; and 
 i) fluid return pathways for cycling said cooled slurry back toward said heat source. 
 
     
     
         4 . A heat dissipation assembly for electronic and electrical components as in  claim 1  comprising
 a) multiple heat transfer pumps; 
 b) means for mounting said pumps adjacent sources of heat; 
 c) each pump utilizing a liquid having a low boiling point and forming bubbles when heated above said boiling point; 
 d) each pump including multiple liquid flow paths; 
 e) said bubbles providing a force to push said liquid through said flow paths; 
 f) heat concentrators mounted adjacent said liquid flow paths for removing heat energy from said liquid. 
 
     
     
         5 . A heat transfer bridge for providing cooling to a transformer tank, said bridge comprising
 a) an enclosed container;   b) a slurry comprising formed of fluid having a low boiling point and metallic foam particles contained in said container;   c) heat sink fins;   d) tube means for circulating said slurry adjacent at least a portion of said transformer tank to absorb heat energy from said tank;   e) a bubble generating chamber for developing bubbles in said slurry as a result of heat absorbed by said slurry from said tank;   f) said bubbles creating a pressure force for moving and stirring said fluid to circulate through tube means; and   h) said heat sink means removing heat energy from said fluid   whereby said tank is cooled.   
     
     
         6 . A heat dissipation assembly for electronic and electrical components as in  claim 1  further including,
 a) an enclosed container for cooling a hot component or other hot spot on a circuit board, 
 b) a fluid having a selectable boiling point contained in said container; 
 c) heat sink means thermally coupled to a first section of said container; 
 d) inserting at least a portion of said heat source in said fluid to provide heat energy to said fluid for generating, in a second section of said container, spaced fluid bubbles; 
 e) mounting said container to enable said bubbles to move in said container; 
 f) said bubbles creating a pressure force for moving and stirring said fluid to circulate toward said second section of said container wherein said heat sink means are positioned; and 
 h) said heat sink means removing heat energy from said fluid. 
 
     
     
         7 . A cooling container as in  claim 6  further including,
 a) a fluid having a selectable boiling point contained in said container; 
 b) heat sink means thermally coupled to a first section of said container; 
 c) thermally coupling said heat source to provide heat energy to said fluid for generating in a second section of said container spaced fluid bubbles with hot fluid between said bubbles; 
 e) mounting said container to enable said bubbles to rise up said container; 
 f) said rising bubbles moving said fluid between the bubbles in the direction of the rising bubbles and toward said second section of said container wherein said heat sink means are positioned; and 
 h) said heat sink means removing heat energy from said fluid. 
 
     
     
         8 . A heat dissipation assembly for electronic and electrical components as in  claim 1  including,
 a) a closed tubular loop; 
 b) a fluid having a low boiling point contained in said tubular loop and flowable through said loop; 
 c) heat sink means thermally coupled to first sections of said loop; 
 d) thermally coupling said heat source to provide heat energy to said fluid for generating spaced fluid bubbles in a section of said tubular loop; 
 e) mounting said second section of said loop to enable said bubbles to rise up said second section of said tubular loop; 
 f) conforming the dimensions of said second section and the dimensions of said bubbles section to confine hot liquid in said spaces between rising bubbles; 
 g) said rising bubbles pushing and pumping said hot fluid through said second section of said loop toward said first section of said loop wherein said heat sink means are mounted; and 
 h) said heat sink means removing heat energy from said hot fluid. 
 
     
     
         9 . A heat dissipation assembly for electronic and electrical components as in  claim 1  further comprising,
 a) a housing including heat concentrators for said assembly; 
 b) fluid retaining tubes within said assembly; 
 c) a fluid having a low boiling point contained within said assembly; 
 d) said tubes forming fluid pathways; 
 e) means for mounting said housing adjacent a heat source; 
 f) said fluid forming bubbles when heated above said boiling point; 
 g) positioning at least one of said tubes pathways to direct said bubbles to move upwardly away from said heat source; 
 h) said bubbles pushing said fluid toward at least one heat concentrator to remove heat from said; and 
 i) fluid return pathways for cycling said cooled fluid chloride back toward said heat source; and 
 j) repeating the cycle. 
 
     
     
         10 . A heat dissipation assembly as in  claim 9  wherein the boiling point of said fluid is below the temperature at which electronic and electrical components may be degraded.