Resin mold

Abstract

To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.

1 . A resin mold having a fine concavo-convex structure on a surface thereof, wherein a fluorine element concentration (Es) in a resin mold surface portion is an average fluorine element concentration (Eb) in the resin forming the resin mold or more. 
     
     
         2 . The resin mold according to  claim 1 , wherein a ratio between the average fluorine element concentration (Eb) in the resin forming the resin mold and the fluorine element concentration (Es) in the resin mold surface portion meets following equation (1).
   1 ≦Es/Eb≦ 1500  Eq. (1)
   
     
     
         3 . The resin mold according to  claim 1  or  2 , wherein total light transmittance at 350 nm to 450 nm is 50% or more. 
     
     
         4 . The resin mold according to  claim 1 , wherein the resin mold is comprised of a cured material of a photopolymerizable mixture formed by photo nanoimprint. 
     
     
         5 . The resin mold according to  claim 4 , wherein the photopolymerizable mixture contains (meth)acrylate, fluorine-containing (meth)acrylate and a photoinitiator. 
     
     
         6 . The resin mold according to  claim 5 , wherein the resin mold contains 0.1 part by weight to 50 parts by weight of the fluorine-containing (meth)acrylate and 0.01 part by weight to 10 parts by weight of the photoinitiator relative to 100 parts by weight of the (meth)acrylate. 
     
     
         7 . The resin mold according to  claim 1 , wherein in a shape of the fine concavo-convex structure, a pitch ranges from 50 nm to 1,000 nm, and a height ranges from 50 nm to 500 nm. 
     
     
         8 . The resin mold according to  claim 1 , wherein the resin mold is for nanoimprint. 
     
     
         9 . The resin mold according to  claim 1 , wherein the ratio between the average fluorine element concentration (Eb) in the resin forming the resin mold and the fluorine element concentration (Es) in the resin mold surface portion meets following equation (2),
   20 ≦Es/Eb≦ 200.  Eq. (2)
   
     
     
         10 . The resin mold according to  claim 9 , wherein the resin mold contains a copolymer comprised of fluorine-containing (meth)acrylate and fluorine-non-containing (meth)acrylate, and the fluorine-containing (meth)acrylate is expressed by following chemical formula (1) and/or following chemical formula (2), 
       
         
           
           
               
               
           
         
       
       (In chemical formula (1), R1 represents following chemical formula (3), and R2 represents following chemical formula (4),) 
       
         
           
           
               
               
           
         
       
       (In chemical formula (3), n is an integer of from 1 to 6,) 
       
         
           
           
               
               
           
         
       
       (In chemical formula (4), R is H or CH 3 .) 
     
     
         11 . The resin mold according to  claim 10 , wherein the resin mold contains 0.8 part by weight to 6 parts by weight of the fluorine-containing (meth)acrylate relative to 100 parts by weight of the fluorine-non-containing (meth)acrylate. 
     
     
         12 . A method of manufacturing the resin mold according to  claim 10 , comprising:
 coating a substrate or a master mold with a photopolymerizable mixture containing 100 parts by weight of fluorine-non-containing (meth)acrylate, 0.8 part by weight to 6 parts by weight of fluorine-containing (meth)acrylate, and a photoinitiator;   pressing the photopolymerizable mixture between the substrate and the master mold;   obtaining a cured material by curing the photopolymerizable mixture by exposure; and   peeling off the cured material from the master mold.