US2013055727A1PendingUtilityA1

Cooling unit

Assignee: CHOI JOONPriority: Sep 2, 2011Filed: Aug 31, 2012Published: Mar 7, 2013
Est. expirySep 2, 2031(~5.1 yrs left)· nominal 20-yr term from priority
Inventors:Joon Choi
H10W 40/47H10W 40/10G06F 2200/201G06F 1/203H05K 7/20G06F 1/20
39
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Disclosed herein is a cooling unit including a case, a magnet which is mounted on a lower portion of the case, a magnetic fluid which is provided on a lower portion of the magnet to absorb heat, and a bracket which supports a lower portion of the magnetic fluid.

Claims

exact text as granted — not AI-modified
1 . A cooling unit comprising:
 a case;   a magnet which is mounted on a lower portion of the case;   a magnetic fluid which is concentrated onto the magnet and absorbs heat; and   a bracket which supports a lower portion of the magnetic fluid.   
     
     
         2 . The cooling unit as set forth in  claim 1 , wherein the magnetic fluid is a fluid that is formed by stabilizing and dispersing magnetic powder in a liquid having a colloidal shape and then adding a surfactant so as not to cause precipitation and cohesion, and absorbs heat transmitted from the bracket. 
     
     
         3 . The cooling unit as set forth in  claim 1 , wherein the case is rectangular and contains the magnet and the magnetic fluid therein, and includes a hole formed on a top surface thereof. 
     
     
         4 . The cooling unit as set forth in  claim 1 , wherein the magnet is rectangular and is a permanent magnet. 
     
     
         5 . The cooling unit as set forth in  claim 1 , wherein the bracket is made of copper. 
     
     
         6 . The cooling unit as set forth in  claim 1 , wherein a CPU is mounted on a lower portion of the bracket and a PCB is mounted on a lower portion of the CPU. 
     
     
         7 . The cooling unit as set forth in  claim 1 , wherein the bracket includes a thermal conduction element formed on a lower portion thereof, and the thermal conduction element is connected to an upper portion of the CPU disposed on a side portion of the cooling unit. 
     
     
         8 . The cooling unit as set forth in  claim 7 , wherein a PCB is mounted on a lower portion of the CPU and the thermal conduction element is extended to a side in a stepwise shape.

Join the waitlist — get patent alerts

Track US2013055727A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.