Ferrite ceramic composition, ceramic electronic component, and process for producing ceramic electronic component

Abstract

This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe 2 O 3 and the molar content (y) of Mn 2 O 3 are expressed by a coordinate point (x,y), the coordinate point (x,y) is located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5).

1 . A ferrite ceramic composition comprising at least Fe, Mn, Ni and Zn,
 wherein, in the ferrite ceramic composition, a molar content of Cu is 0 to 5 mol % in terms of CuO content and, when a molar content (x (mol %)) of Fe in terms of Fe 2 O 3  content and a molar content (y (mol %)) of Mn in terms of Mn 2 O 3  content are expressed by a coordinate point (x,y), the coordinate point (x,y) is located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5).   
     
     
         2 . The ferrite ceramic composition according to  claim 1 , wherein the molar content of Zn is 33 mol % or less in terms of ZnO content. 
     
     
         3 . The ferrite ceramic composition according to  claim 1 , wherein the molar content of Zn is 6 mol % or more in terms of ZnO content. 
     
     
         4 . The ferrite ceramic composition according to  claim 2 , wherein the molar content of Zn is 6 mol % or more in terms of ZnO content. 
     
     
         5 . A ceramic electronic component comprising a magnetic body part and a metal wire material embedded in the magnetic body part,
 wherein the metal wire material comprises an electrically conductive material containing Cu as the main component and the magnetic body part comprises the ferrite ceramic composition claimed in  claim 1 .   
     
     
         6 . The ceramic electronic component according to  claim 5 , wherein the metal wire material has a linear shape. 
     
     
         7 . The ceramic electronic component according to  claim 5 , wherein the metal wire material has a spiral shape. 
     
     
         8 . A ceramic electronic component comprising a magnetic body part and a metal wire material embedded in the magnetic body part,
 wherein the metal wire material comprises an electrically conductive material containing Cu as the main component and the magnetic body part comprises the ferrite ceramic composition claimed in  claim 2 .   
     
     
         9 . The ceramic electronic component according to  claim 8 , wherein the metal wire material has a linear shape. 
     
     
         10 . The ceramic electronic component according to  claim 8 , wherein the metal wire material has a spiral shape. 
     
     
         11 . A ceramic electronic component comprising a magnetic body part and a metal wire material embedded in the magnetic body part,
 wherein the metal wire material comprises an electrically conductive material containing Cu as the main component and the magnetic body part comprises the ferrite ceramic composition claimed in  claim 3 .   
     
     
         12 . The ceramic electronic component according to  claim 11 , wherein the metal wire material has a linear shape. 
     
     
         13 . The ceramic electronic component according to  claim 11 , wherein the metal wire material has a spiral shape. 
     
     
         14 . A ceramic electronic component comprising a magnetic body part and a metal wire material embedded in the magnetic body part,
 wherein the metal wire material comprises an electrically conductive material containing Cu as the main component and the magnetic body part comprises the ferrite ceramic composition claimed in  claim 4 .   
     
     
         15 . The ceramic electronic component according to  claim 14 , wherein the metal wire material has a linear shape. 
     
     
         16 . The ceramic electronic component according to  claim 14 , wherein the metal wire material has a spiral shape. 
     
     
         17 . The ceramic electronic component according to  claim 5 , wherein the magnetic body part is fired in an atmosphere having an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure for Cu—Cu 2 O. 
     
     
         18 . A process for producing a ceramic electronic component, comprising:
 a calcination step of weighing an Fe compound, an Mn compound, a Cu compound, a Zn compound and an Ni compound precisely in such a manner that a molar content of Cu becomes 0 to 5 mol % in terms of CuO content and, when a molar content (x (mol %)) of Fe in terms of Fe 2 O 3  content and a molar content (y (mol %)) of Mn in terms of Mn 2 O 3  content are expressed by a coordinate point (x,y), the coordinate point (x,y) can be located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5), mixing the weighed compounds together, and calcining the resultant mixture, thereby producing a calcined powder;   a ceramic thin layer body production step of producing ceramic thin layer bodies from the calcined powder;   a laminate formation step of laminating the multiple ceramic thin layer bodies on each other in such a manner that a metal wire material containing Cu as the main component and having a linear shape is intercalated between at least a pair of the ceramic thin layer bodies, thereby forming a laminate; and   a firing step of firing the laminate in a firing atmosphere having an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure for Cu—Cu 2 O.   
     
     
         19 . A process for producing a ceramic electronic component, comprising:
 a calcination step of weighing an Fe compound, an Mn compound, a Cu compound, a Zn compound and an Ni compound precisely in such a manner that a molar content of Cu becomes 0 to 5 mol % in terms of CuO content and, when a molar content (x (mol %)) of Fe in terms of Fe 2 O 3  content and the molar content (y (mol %)) of Mn in terms of Mn 2 O 2  content are expressed by a coordinate point (x,y), the coordinate point (x,y) can be located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5), mixing the weighed compounds together, and calcining the resultant mixture, thereby producing a calcined powder;   a ferrite paste production step of producing a ferrite paste from the calcined powder;   a molding production step of placing a metal wire material containing Cu as the main component in a mold, then injecting the ferrite paste into the mold and carrying out a molding treatment to produce a molding; and   a firing step of firing the molding in a firing atmosphere having an oxygen partial pressure equal to or lower than the equilibrium oxygen partial pressure for Cu—Cu 2 O.