US2013069246A1PendingUtilityA1
Methods of forming electronic devices
Est. expiryJun 26, 2029(~3 yrs left)· nominal 20-yr term from priority
H10P 76/204H10W 20/20G03F 7/0035G03F 7/0045G03F 7/26G03F 7/004G03F 7/40H10P 76/00H10P 76/20G03F 7/265H01L 23/481
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Abstract
Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.
Claims
exact text as granted — not AI-modified1 - 8 . (canceled)
9 . A coated substrate, comprising:
(a) a semiconductor substrate comprising one or more layers to be patterned; (b) a resist pattern over the one or more layers to be patterned, the resist pattern comprising a first plurality of openings and having an alkaline surface; and (c) a layer of a composition in the first plurality of openings of the resist pattern, the composition comprising a resin component and an acid generator.
10 . The coated substrate of claim 9 , wherein the layer is photosensitive and the acid generator is a photoacid generator.Cited by (0)
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