High-frequency waveguide structure
Abstract
For integration into a CMOS/BICMOS process, a high-frequency waveguide structure, a diode-bridge structure and an imaging/spectroscopy system and a method for manufacturing a high-frequency waveguide structure are provided, wherein a height of each of a first and a second conducting lines ( 11, 12 ) is higher than a width of each of the first and the second conducting lines ( 11, 12 ). The first and second conducting lines ( 11, 12 ) form a slotline waveguide, wherein the third conducting line ( 13 ) together with the first and the second conducting lines ( 11, 12 ) form a (co-)planar waveguide.
Claims
exact text as granted — not AI-modified1 . A high-frequency waveguide structure, comprising:
a substrate; a first and a second conducting line located in a first layer (A) on the substrate; and a third conducting line located in the symmetry plane (G) between the first and the second conducting lines wherein a height (h) of each of the first and the second conducting lines is higher than a width (w) of each of the first and second conducting lines.
2 . The high-frequency waveguide structure as claimed in any one of the preceding claims, wherein the third conducting line is located in a second layer (B, C) above or below the first layer (A).
3 . The high-frequency waveguide structure as claimed claim 1 , wherein the first and the second conducting lines form a first waveguide for a slotline mode, and wherein the third conducting line together with the first and second conducting lines form a second waveguide for a planar waveguide-mode or a co-planar waveguide mode.
4 . The high-frequency waveguide structure as claimed in claim 1 , wherein the coupling between the first and the second conducting line is higher than the coupling between the first or the second conducting line to the substrate.
5 . The high-frequency waveguide structure as claimed in claim 1 , wherein the electric field of the slotline mode is mainly confined in-between the first and the second conducting lines.
6 . The high-frequency waveguide structure as claimed in claim 1 , wherein the electric field of the slotline mode is substantially zero in the symmetry plane G of the first and the second conducting lines.
7 . The high-frequency waveguide structure as claimed in claim 1 , wherein the high-frequency waveguide structure is integrated into a CMOS/BICMOS device.
8 . The high-frequency waveguide structure as claimed in claim 1 , wherein the first and the second conducting lines are formed by a patterned thick metal layer.
9 . A diode-bridge structure being connected to a high-frequency waveguide structure according to claim 1 , comprising:
a first interconnecting structure between the first conducting line and the third conducting line comprising a first diode being connected with its cathode to the third conducting line and a first capacitor connected in series; and a second interconnecting structure between the second conducting line and the third conducting line comprising a second diode being connected with its anode to the third conducting line and a second capacitor connected in series.
10 . The diode-bridge structure as claimed in claim 9 , wherein the first and the second capacitors are located on two intermediate metal layers under the first and the second conducting lines, respectively.
11 . The diode-bridge structure as claimed in claim 9 , wherein the first and the second diodes are located in the substrate under the first and the second conducting lines, respectively.
12 . An imaging/spectroscopy system for analyzing a sample using electromagnetic radiation in the sub-terahertz and/or terahertz region comprising:
a transmitter for transmitting electromagnetic radiation in the sub-terahertz and/or terahertz region to the sample; a receiver comprising high-frequency generator and a diode bridge structure according to claim 9 , for receiving electromagnetic radiation in the sub-terahertz and/or terahertz region from the sample.
13 . The imaging/spectroscopy system as claimed in claim 12 , wherein the high-frequency generator comprises a nonlinear transmission line for generating a signal with a very wide spectral content.
14 . The imaging/spectroscopy system as claimed in claim 12 , wherein the high-frequency generator is connected to a high-frequency waveguide structure.
15 . Method for manufacturing a high-frequency waveguide structure comprising the steps of:
providing a substrate; providing a dielectric material on the substrate; providing a thick metal layer in a first layer (A) on the dielectric material, processing a first and a second conducting line by structuring the thick metal layer, wherein a height of each of the first and the second conducting lines is higher than a width of each of the first and a second conducting lines; and processing a third conducting line located in the symmetry plane (G) between the first and the second conducting lines before or after processing the first and the second conducting line.Join the waitlist — get patent alerts
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