Stackable electronic component

Abstract

An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side.

What is claimed is: 
     
         1 . A method, comprising:
 placing a first component over a circuit board; and   placing a first portion of a second component over the first component such that a second portion of the second component contacts the circuit board, and such that the first and second portions of the second component define a space within which is located the first component.   
     
     
         2 . The method of  claim 1  wherein placing the first component comprises placing the first component in contact with the circuit board. 
     
     
         3 . The method of  claim 1 , further comprising at least partially filling a space between the first component and the first portion of the second component with a thermally conductive material. 
     
     
         4 . The method of  claim 1  wherein placing the first and second components comprises soldering the first component and the second portion of the second component to the board. 
     
     
         5 . The method of  claim 1  wherein:
 placing the first component comprises coupling a lead of the first component to a conductive path disposed on the circuit board; and 
 placing the second component comprises coupling a lead of the second component to the conductive path.