Optical elements, method of replicating optical elements, particularly on a wafer level, and optical devices

Abstract

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

1 .- 30 . (canceled) 
     
     
         31 . An integrated dual sided multiple optical element comprising:
 a substrate having two surfaces;   lithographically defined optics on both surfaces; and   additional lithographically defined features on at least one surface from which material is selectively removed or added at one time.   
     
     
         32 . The optical element according to  claim 31 , wherein one surface of said substrate includes a diffractive element for providing at least one of beam splitting, creating multiple spots and diffusely illuminating a specific area. 
     
     
         33 . The optical element according to  claim 32 , wherein said diffractive element is a plurality of diffractive elements. 
     
     
         34 . The optical element according to  claim 31 , wherein said substrate is a wafer and said optics are an array of optical elements. 
     
     
         35 . The optical element according to  claim 31 , wherein said additional lithographically defined features include metal portions for blocking light. 
     
     
         36 . The optical element according to  claim 31 , wherein said additional lithographically defined features include metal portions for assisting in bonding active element to the integrated multiple optical element. 
     
     
         37 .- 50 . (canceled) 
     
     
         51 . An optical device, comprising:
 a first substrate having top and bottom surfaces;   a second substrate having top and bottom surfaces, a substantially planar portion of the top surface of the second substrate being secured to a substantially planar portion of the bottom surface of the first substrate;   a first element having optical power therein on a first surface of the top and bottom surfaces of the first and second substrates, the first element being a lithograph;   a second element having optical power therein on a second surface of the top and bottom surfaces of the first and second substrates, the first and second surfaces being different, the second element being a replica; and   a structure between the first and second substrates sealing an interior space between the substantially planar portion of the top surface of the second substrate and the substantially planar portion of the bottom surface of the first substrate.   
     
     
         52 . A method of making optical elements comprising:
 making a master including an optical element;   imprinting a replica of said optical element in an imprintable material by applying the master to the imprintable material;   providing a support substrate for the replica;   confirming alignment of the support substrate and the master;   tacking together the support substrate and master at discrete locations once alignment is confirmed;   fixing the imprintable material to form a hardened replica; and   removing the master from the hardened replica.   
     
     
         53 . The method according to  claim 52 , said confirming alignment of the support substrate and the wafer master is done in a mask aligner. 
     
     
         54 . The method according to  claim 54 , further comprising removing the support substrate and the wafer master from the mask aligner after said tacking and then fixing the imprintable material.