Film-forming apparatus and film-forming method

Abstract

A film-forming apparatus and film-forming method comprising a film-forming chamber for being supplied a reaction gas, a substrate placed on a susceptor in the film-forming chamber, a heater for heating the substrate, a transfer chamber adjacent to the film-forming chamber, transferring the substrate to the film-forming chamber, measuring the temperature of the substrate, rotating the substrate via the susceptor, a detecting unit for detecting rotating direction and angle of the rotating unit, generating data of the substrate using temperature data of the substrate measured by the temperature-measuring unit while the substrate is rotating, and positional data of coordinates at which temperature is measured, generated based on the rotating direction and angle, acquiring data of the movement direction and amount of positional error of the substrate based on the data, a control unit for adjusting position of the transfer unit based on the amount of position error of the substrate.

What is claimed is: 
     
         1 . A film-forming apparatus comprising:
 a film-forming chamber for being supplied a reaction gas;   a susceptor for placing a substrate on, provided in the film-forming chamber;   a heater for heating the substrate, provided below the susceptor;   a transfer chamber being adjacent to the film-forming chamber;   a transfer unit for transferring the substrate to the film-forming chamber, provided in the transfer chamber;   a temperature-measuring unit for measuring temperature of the substrate;   a rotating unit for rotating the substrate via the susceptor;   a detecting unit for detecting rotating direction and rotation angle of the rotating unit;   an analysis unit for generating temperature distribution data of the substrate using temperature data of the substrate measured by the temperature-measuring unit while the substrate is rotating, and positional data of coordinates at which temperature is measured, generated based on the rotating direction and the rotation angle detected by the detecting unit, and the analysis unit for acquiring data of the movement direction and an amount of positional error of the substrate based on the temperature distribution data;   a control unit for adjusting position of the transfer unit based on data of the movement direction and the amount of position error of the substrate.   
     
     
         2 . The film-forming apparatus according to  claim 1 , wherein the analysis unit determines whether the amount of positional error is at an allowable value or less than the allowable value, and sends data of the movement direction and the amount of positional error to the control unit if the amount of positional error is more than the allowable value. 
     
     
         3 . The film-forming apparatus according to  claim 1 ,
 wherein the temperature-measuring unit has a radiation thermometer provided outside the film-forming chamber to measure a temperature of the substrate, by receiving radiant light from the substrate.   
     
     
         4 . The film-forming apparatus according to  claim 3 ,
 wherein the location of temperature measurement on the substrate, performed via the radiation thermometer, is capable of being moved.   
     
     
         5 . The film-forming apparatus according to  claim 4 ,
 wherein the location of temperature measurement on the substrate is capable of moving a predetermined distance.   
     
     
         6 . The film-forming apparatus according to  claim 3 ,
 wherein the temperature-measuring unit has a first radiation thermometer for measuring a temperature of the center position of the substrate by receiving the radiant light from the substrate, and a second radiation thermometer for measuring a temperature of the periphery of the substrate.   
     
     
         7 . The film-forming apparatus according to  claim 6 ,
 wherein the location of temperature measurement on the substrate, performed via the second radiation thermometer, is capable of being moved.   
     
     
         8 . The film-forming apparatus according to  claim 7 ,
 wherein the location of temperature measurement on the substrate by the second radiation thermometer is capable of moving a predetermined distance.   
     
     
         9 . The film-forming apparatus according to  claim 1 ,
 wherein the heating unit has a first heater for heating the substrate, and a second heater for heating the periphery of the substrate.   
     
     
         10 . A film-forming method comprising:
 transferring a substrate into a film-forming chamber by a transfer unit, and placing the substrate on a susceptor by a substrate-supporting portion;   measuring a temperature of the periphery of the substrate while the substrate is rotating and detecting the rotating direction and rotation angle of the substrate;   generating temperature distribution data of the substrate based on the data of the temperature, rotation direction and rotation angle of the substrate to acquire data of a movement direction and an amount of positional error of the substrate;   adjusting the position of the transfer unit based on the data of the movement direction and the amount of positional error;   transferring the substrate from the film-forming chamber;   returning the substrate which was transferred out of the film-forming chamber, back into the film-forming chamber by the adjusted transfer unit;   placing the substrate on the susceptor by the substrate-supporting portion;   supplying the reaction gas into the film-forming chamber, and forming a predetermined film on the substrate while the substrate is heated.   
     
     
         11 . The film-forming method according to  claim 10 , wherein the temperature of the substrate is measured on two or more alternative circumferences, that are on the outer periphery of the substrate, when the center of the substrate is aligned with the center of the susceptor. 
     
     
         12 . The film-forming method according to  claim 10 , wherein the position of the transfer unit is adjusted when the amount of positional error is more than an allowable value. 
     
     
         13 . A film-forming method comprising:
 transferring a first substrate into a film-forming chamber by a transfer unit, and placing the first substrate on a susceptor by a substrate-supporting portion;   measuring the temperature of the first substrate while the first substrate is rotating, and detecting the rotating direction and rotation angle of the first substrate;   generating temperature distribution data of the first substrate based on the data of the first temperature, rotation direction and rotation angle of the first substrate to acquire data of a movement direction and an amount of positional error of the first substrate;   adjusting the position of the transfer unit based on the data of the movement direction and the amount of positional error;   transferring the first substrate out of the film-forming chamber;   transferring a second substrate back into the film-forming chamber by the transfer unit wherein the second substrate consists of the same material as the first substrate;   placing the second substrate on the susceptor by the substrate-supporting portion;   supplying a reaction gas into the film-forming chamber to form a predetermined film on the second substrate while the second substrate is heated.   
     
     
         14 . The film-forming method according to  claim 13 , wherein the temperature of the substrate is measured on the circumferences that are on the outer periphery of the substrate when the center of the substrate is aligned with the center of the susceptor. 
     
     
         15 . The film-forming method according to  claim 14 , wherein the temperature of the substrate is measured on two or more circumferences that are on the outer periphery of the substrate when the center of the substrate is aligned with the center of the susceptor. 
     
     
         16 . The film-forming method according to  claim 13 , wherein the position of the transfer unit is adjusted when the amount of positional error is more than an allowable value.