Semiconductor device and method for manufacturing the same

Abstract

According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

What is claimed is: 
     
         1 . A semiconductor device comprising:
 a first molded body covering a first light emitting element, a part of a primary lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a secondary lead electrically connected to the first light receiving element with a first resin;   a second molded body covering a second light emitting element, a part of a primary lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a secondary lead electrically connected to the second light receiving element with the first resin; and   a third molded body molding the first molded body and the second molded body as one body using a second resin,   one of the primary lead and the secondary lead being disposed to extend over the first molded body and the second molded body, and a surface of a portion extending between the first molded body and the second molded body being covered with a thin film made of the first resin.   
     
     
         2 . The device according to  claim 1 , wherein
 a light emitting surface of the first light emitting element is disposed opposed to a light receiving surface of the first light receiving element and   a light emitting surface of the second light emitting element is disposed opposed to a light receiving surface of the second light receiving element.   
     
     
         3 . The device according to  claim 1 , wherein a main component of the first resin is same as a main component of the second resin. 
     
     
         4 . The device according to  claim 1 , wherein the thin film is provided continuously between the first molded body and the second molded body and covered with the second resin. 
     
     
         5 . The device according to  claim 1 , wherein
 the first resin transmits light emitted from the first light emitting element and the second light emitting element and   the second resin blocks external light.   
     
     
         6 . The device according to  claim 1 , wherein the third molded body includes a shield portion blocking light of the second light emitting element propagated toward the first light receiving element and blocking light of the first light emitting element propagated toward the second light receiving element. 
     
     
         7 . The device according to  claim 1 , wherein the one of the primary lead and the secondary lead disposed to extend over the first molded body and the second molded body includes a first mount portion having the first light receiving element mounted, a second mount portion having the second light receiving element mounted, and a connection portion connecting the first mount portion to the second mount portion, and the connection portion is provided between the first molded body and the second molded body. 
     
     
         8 . The device according to  claim 1 , wherein
 each of the first light receiving element and the second light receiving element includes a light receiving surface, a power supply terminal, a signal terminal, and a ground terminal and   the device includes a secondary lead configured to supply an electric power to the power supply terminal and a secondary lead configured to output a signal from the signal terminal.   
     
     
         9 . The device according to  claim 8 , wherein the secondary lead configured to supply the electric power to the power supply terminal is disposed to extend over the first molded body and the second molded body and includes a portion covered with the thin film. 
     
     
         10 . The device according to  claim 1 , wherein each of the primary lead and the secondary lead includes a portion extending from the third molded body. 
     
     
         11 . The device according to  claim 10 , wherein
 the primary lead connected to the first light emitting element and the primary lead connected to the second light emitting element extend from one side surface of the third molded body and   the secondary lead connected to the first light receiving element and the secondary lead connected to the second light receiving element extend from another side surface on an opposite side to the one side surface.   
     
     
         12 . A semiconductor device comprising:
 a first lead;   a first light emitting element fixed to the first lead;   a second lead disposed away from the first lead and electrically connected to the first light emitting element via a first wire;   a third lead disposed away from the first lead and the second lead;   a second light emitting element fixed to the third lead;   a fourth lead disposed away from the first lead, the second lead, and the third lead and electrically connected to the second light emitting element via a second wire;   a fifth lead disposed away from the first lead, the second lead, the third lead, and the fourth lead and including a first mount portion and a second mount portion;   a first light receiving element fixed to the first mount portion and configured to detect a light emitted from the first light emitting element;   a second light receiving element fixed to the second mount portion and configured to detect a light emitted from the second light emitting element;   a sixth lead disposed away from the first lead, the second lead, the third lead, the fourth lead, and the fifth lead and electrically connected to the first light receiving element via a third wire;   a seventh lead disposed away from the first lead, the second lead, the third lead, the fourth lead, the fifth lead, and the sixth lead and electrically connected to the second light receiving element via a fourth wire;   a first molded body covering a portion of the first lead with the first light emitting element fixed, the first wire, a portion of the second lead with the first wire bonded, the first mount portion with the first light receiving element fixed, the third wire, and a portion of the sixth lead with the third wire bonded;   a second molded body covering a portion of the third lead with the second light emitting element fixed, the second wire, a portion of the fourth lead with the second wire bonded, the second mount portion with the second light receiving element fixed, the fourth wire, and a portion of the seventh lead with the fourth wire bonded; and   a third molded body molding the first molded body, the second molded body, and a portion of the fifth lead between the first mount portion and the second mount portion as one body, the portion of the fifth lead extending between the first molded body and the second molded body,   a part of the fifth lead being covered with a thin film made of a first resin contained in the first molded body and the second molded body, a second resin contained in the third molded body covering the thin film.   
     
     
         13 . The device according to  claim 12 , wherein
 the first molded body and the second molded body transmit the light emitted from the first light emitting element and the second light emitting element and   the third molded body blocks external light.   
     
     
         14 . The device according to  claim 12 , wherein the third molded body includes a shield portion blocking the light of the second light emitting element propagated toward the first light receiving element and blocking the light of the first light emitting element propagated toward the second light receiving element. 
     
     
         15 . The device according to  claim 12 , wherein
 each of the first lead, the second lead, the third lead, and the fourth lead includes a portion extending from one side surface of the third molded body and   each of the fifth lead, the sixth lead, and the seventh lead includes a portion extending from another side surface on an opposite side to the one side surface.   
     
     
         16 . A method for manufacturing a semiconductor device comprising:
 preparing
 a first frame including a first lead with a first light emitting element fixed, a second lead electrically connected to the first light emitting element via a first wire, a third lead with a second light emitting element fixed, and a fourth lead electrically connected to the second light emitting element via a second wire and 
 a second frame including a fifth lead with a first light receiving element fixed to a first mount portion and with a second light receiving element fixed to a second mount portion, a sixth lead electrically connected to the first light receiving element via a third wire, and a seventh lead electrically connected to the second light receiving element via a fourth wire; 
   setting a combination of the first frame and the second frame in a die and performing molding including:
 housing a portion of the first lead with the first light emitting element fixed, a portion of the second lead with the first wire bonded, the first mount portion with the first light receiving element fixed, and a portion of the sixth lead with the third wire bonded in a first cavity of the die in a state of a light emitting surface of the first light emitting element and a light receiving surface of the first light receiving element being faced each other; 
 housing a portion of the third lead with the second light emitting element fixed, a portion of the fourth lead with the second wire bonded, the second mount portion with the second light receiving element fixed, and a portion of the seventh lead with the fourth wire bonded in a second cavity of the die in a state of a light emitting surface of the second light emitting element and a light receiving surface of the second light receiving element being faced each other; 
 housing part of the fifth lead between the first mount portion and the second mount portion in a gap communicating the first cavity with the second cavity; and 
 filling the first cavity, the second cavity, and the gap with a first resin; and 
   forming a third molded body made of a second resin and covering a first molded body molded in the first cavity, a second molded body molded in the second cavity, and part of the fifth lead covered with a thin film made of the first resin.   
     
     
         17 . The method according to  claim 16 , wherein the die includes a through gate communicating the first cavity with the second cavity. 
     
     
         18 . The method according to  claim 16 , wherein a main component of the first resin is same as a main component of the second resin. 
     
     
         19 . The method according to  claim 16 , wherein
 the first resin transmits a light emitted from the first light emitting element and the second light emitting element and   the second resin contains a member absorbing external light.   
     
     
         20 . The method according to  claim 16 , wherein
 the first resin transmits a light emitted from the first light emitting element and the second light emitting element and   the second resin contains a member reflecting external light.