Cu-Co-Si System Alloy Sheet and Method for Manufacturing Same

Abstract

The present invention provides a Cu—Co—Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for plate. The copper alloy sheet for electronic materials, contains 0.5 to 3.0 mass % Co, 0.1 to 1.0 mass % Si, the balance being Cu and unavoidable impurities, wherein an average grain size in the center part of the sheet thickness is 20 μm or less, and the number of the crystal grain, being tangent to a surface of the sheet and having 45 μm or more of the length of major axis, is 5 or less in the area of 1 mm in a rolling direction.

1 . A copper alloy sheet for electronic materials, containing 0.5 to 3.0 mass % Co, 0.1 to 1.0 mass % Si, the balance being Cu and unavoidable impurities, wherein
 an average grain size in the center part of the sheet thickness is 20 μm or less, and   the number of the crystal grain, being tangent to a surface of the sheet and having 45 μm or more of the length of major axis, is 5 or less in the area of 1 mm in a rolling direction.   
     
     
         2 . The copper alloy sheet for electronic materials of  claim 1 , wherein Cr is furthermore contained in a maximum amount of 0.5 mass %. 
     
     
         3 . The copper alloy for electronic materials of  claim 1 , wherein a single element or two or more elements selected from Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag are furthermore contained in total in a maximum amount of 2.0 mass %. 
     
     
         4 . A method for manufacturing the copper alloy sheet according to  claim 1 , comprising sequentially conducting:
 a step for casting an ingot;   a step for heating the ingot for 1 hour or more at material temperature being 950° C. to 1050° C., thereafter hot rolling the ingot, setting the temperature to 700° C. or more when hot rolling is completed;   a step for conducting an intermediate rolling before a solution treatment, by conducting the last pass at a reduction ratio being 8% or more;   a step for conducting a intermediate solution treatment, by heating at material temperature being 850° C. to 1050° C., for 0.5 minute to 1 hour;   a step for conducting aging, by heating at 400° C. to 600° C.; and   a step for conducting last rolling at a reduction ratio being 10 to 50%.   
     
     
         5 . The copper alloy for electronic materials of  claim 2 , wherein a single element or two or more elements selected from Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag are furthermore contained in total in a maximum amount of 2.0 mass %. 
     
     
         6 . A method for manufacturing the copper alloy sheet according to  claim 2 , comprising sequentially conducting:
 a step for casting an ingot;   a step for heating the ingot for 1 hour or more at material temperature being 950° C. to 1050° C., thereafter hot rolling the ingot, setting the temperature to 700° C. or more when hot rolling is completed;   a step for conducting an intermediate rolling before a solution treatment, by conducting the last pass at a reduction ratio being 8% or more;   a step for conducting a intermediate solution treatment, by heating at material temperature being 850° C. to 1050° C., for 0.5 minute to 1 hour;   a step for conducting aging, by heating at 400° C. to 600° C.; and   a step for conducting last rolling at a reduction ratio being 10 to 50%.