Electronic device with laminated structure and manufacturing method thereof

Abstract

The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates: thereby making an electronic device more firm with higher shock resistance.

What is claimed is: 
     
         1 . An electronic device with a laminated structure, comprising:
 a first substrate;   a second substrate; and   a solid-state adhesive layer disposed between the first substrate and the second substrate, wherein the solid-state adhesive layer reacts with the first substrate and the second substrate to form chemically linked chains for bonding the first substrate and the second substrate.   
     
     
         2 . The electronic device with the laminated structure of  claim 1 , wherein the chemically linked chains are formed by hydrogen bonds. 
     
     
         3 . The electronic device with the laminated structure of  claim 1 , wherein the solid-state adhesive layer is a PVB adhesive layer. 
     
     
         4 . The electronic device with the laminated structure of  claim 1 , wherein tensile strength of the solid-state adhesive layer is more than or equal to 200 kg/cm 2 . 
     
     
         5 . The electronic device with the laminated structure of  claim 1 , wherein shrinking rate of the solid-state adhesive layer is less than 3%. 
     
     
         6 . The electronic device with the laminated structure of  claim 1 , wherein the electronic device is a touch device, wherein the first substrate is a touch substrate comprising a touch inductive unit, and wherein the second substrate is a top cover substrate. 
     
     
         7 . The electronic device with the laminated structure of  claim 6 , wherein the touch inductive unit is a capacitive touch inductive unit or a resistive touch inductive unit. 
     
     
         8 . The electronic device with the laminated structure of  claim 1 , wherein the electronic device is a display device. 
     
     
         9 . A manufacturing method for an electronic device with a laminated structure, comprising the following steps of:
 disposing a solid-state adhesive layer between a first substrate and a second substrate; and   forming chemically linked chains between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.   
     
     
         10 . The manufacturing method of  claim 9 , wherein the step of forming the chemically linked chains comprises a heating and a pressurizing process. 
     
     
         11 . The manufacturing method of  claim 10 , wherein the step before the heating, and pressurizing process comprises:
 fixing the first substrate and the second substrate by a fixture;   putting the fixed first substrate, the solid-state adhesive layer, and the second substrate together into a vacuum packaging bag; conducting vacuum packaging machine; and   conducting a cool-exhaust and heat-exhaust process to exclude air from spaces between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.   
     
     
         12 . The manufacturing method of  claim 10 , wherein the steps after the heating and
 pressurizing process comprises:   cooling the first substrate, the solid-state adhesive layer, and the second substrate; and   removing the vacuum packaging bags.   
     
     
         13 . The manufacturing method of  claim 10 , wherein the pressurizing and heating process is conducted in a high-pressure furnace. 
     
     
         14 . The manufacturing method of  claim 9 , wherein the chemically linked chains are formed by hydrogen bonds. 
     
     
         15 . The manufacturing method of  claim 9 , wherein the solid-state adhesive layer is a PVB adhesive layer. 
     
     
         16 . The manufacturing method of  claim 9 , wherein tensile strength of the solid-state adhesive layer is more than or equal to 200 kg/cm 2 . 
     
     
         17 . The manufacturing method of  claim 9 , wherein shrinking rate of the solid-state adhesive layer is less than 3%. 
     
     
         18 . The manufacturing method of  claim 9 , wherein the electronic device is a display device. 
     
     
         19 . The manufacturing method of  claim 9 , wherein the electronic device is a touch display device.