Heat pipe dissipating system and method

Abstract

In one embodiment of the disclosure, a heat pipe device for dissipating heat from a heat source includes a porous wick structure having a first porous wick portion disposed adjacent to a second porous wick portion. The first porous wick portion is defined by a first set of microgrooves. The second porous wick portion is defined by a second set of microgrooves disposed in non-parallel adjacent alignment to the first set of microgrooves. The heat pipe device may be disposed within a closed chamber enclosure to which the heat source is attached. In further embodiments, methods are disclosed for manufacturing devices for dissipating heat from a heat source, and for using devices to dissipate heat from a heat source.

1 . A device for dissipating heat from a heat source comprising:
 a first porous wick portion comprising a first set of microgrooves; and   a second porous wick portion comprising a second set of microgrooves, the first and second porous wick portions disposed adjacent to one another so that the first set of microgrooves is disposed in non-parallel, adjacent alignment to the second set of microgrooves.   
     
     
         2 . The device of  claim 1  wherein said adjacent first and second porous wick portions comprise separately molded and separately sintered members. 
     
     
         3 . The device of  claim 2  wherein said separately molded and separately sintered members are sintered together so that they are attached together. 
     
     
         4 . The device of  claim 1  wherein said first and second sets of microgrooves are disposed in perpendicular, adjacent alignment. 
     
     
         5 . The device of  claim 1  wherein a surface of said device is disposed adjacent to a heat source. 
     
     
         6 . The device of  claim 1  wherein fluid is disposed within first porous walls of said first set of microgrooves and within second porous walls of said second set of microgrooves. 
     
     
         7 . The device of  claim 1  wherein vapor is disposed within said first and second sets of microgrooves. 
     
     
         8 . The device of  claim 1  wherein pores of porous walls of said second set of microgrooves are configured to flow evaporated vapor from said porous walls into said second set of microgrooves. 
     
     
         9 . The device of  claim 1  wherein pores of porous walls of said first set of microgrooves are configured to flow condensed fluid from said first set of microgrooves into said first porous walls. 
     
     
         10 . The device of  claim 1  wherein said first and second sets of microgrooves are interconnected and configured to allow vapor to flow within and between said first and second set of microgrooves. 
     
     
         11 . The device of  claim 1  wherein first porous walls of said first set of microgrooves and second porous walls of said second set of microgrooves are interconnected and configured to allow fluid to flow within and between said first and second porous walls. 
     
     
         12 . The device of  claim 1  wherein fluid is disposed within first porous walls of said first set of microgrooves and within second porous walls of said second set of microgrooves, and vapor is disposed within said first and second sets of microgrooves. 
     
     
         13 . The device of  claim 12  wherein pores of said second porous walls of said second set of microgrooves are configured to flow evaporated vapor from said second porous walls into said second set of microgrooves, pores of said first porous walls of said first set of microgrooves are configured to flow condensed fluid from said first set of microgrooves into said first porous walls, said first and second sets of microgrooves are interconnected and configured to allow vapor to flow within and between said first and second set of microgrooves, and said first porous walls and said second porous walls are interconnected and configured to allow fluid to flow within and between said first and second porous walls. 
     
     
         14 . The device of  claim 1  wherein the device is enclosed within a chamber enclosure. 
     
     
         15 . A vapor chamber for transferring heat with an internal working fluid, the vapor chamber comprising a sealed enclosure having interior walls and containing a wick material attached to at least one of the walls, wherein the wick material includes a first portion oriented in a first direction and a second portion oriented in a second direction different than the first direction, such that working fluid is free to travel in both the first and second directions. 
     
     
         16 . The vapor chamber of  claim 15  wherein each of the first and second portions of the wick material has microgrooves which define the direction of orientation. 
     
     
         17 . The vapor chamber of  claim 16  wherein the first and second portions of the wick material are interlocked. 
     
     
         18 . The vapor chamber of  claim 15  wherein the first and second directions are perpendicular. 
     
     
         19 . The vapor chamber of  claim 15  wherein said first and second portions comprise separately molded and separately sintered members. 
     
     
         20 . The vapor chamber of  claim 15  wherein said separately molded and separately sintered members are sintered together so that they are attached together.