Induction-based heat retentive server

Abstract

A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.

What is claimed is: 
     
         1 . A heat retentive server comprising:
 a body having an inner chamber, the body having a heat deflection temperature;   an induction-heatable member positioned in the chamber, the induction-heatable member being heatable by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the body; and   thermal material positioned in the chamber and enveloping the induction-heatable member, the thermal material being adapted for providing predetermined conductive heat transfer from the induction-heatable member to the body so that at least a portion of the body is heated to a second temperature that is greater than the heat deflection temperature of the body in response to the induction-heatable member being heated by electromagnetic induction to the first temperature, and the second temperature is less than the first temperature.   
     
     
         2 . The heat retentive server according to  claim 1 , wherein the first temperature is more than 81° F. hotter than the second temperature. 
     
     
         3 . The heat retentive server according to  claim 1 , wherein the induction-heatable member comprises a metal plate and a porcelain enamel coating that encloses the metal plate. 
     
     
         4 . The heat retentive server according to  claim 1  in combination with a dish and an insulated cover, wherein:
 the insulated cover is for coving the dish and food while the dish is upon the server and the food is upon the dish; and 
 the server and the insulated cover are cooperative for keeping the food at a temperature above 140° F. for one hour after the food and the dish, which together are on the server, are covered with the insulated cover, with the food weighing about 12 to about 14 ounces and being at a temperature of about 165° F. when placed on the dish, and the dish being at about room temperature when placed on the server. 
 
     
     
         5 . The heat retentive server according to  claim 1 , wherein the heat deflection temperature is in a range from about 417° F. to about 511° F. 
     
     
         6 . The heat retentive server according to  claim 1 , wherein the heat deflection temperature of the body is about 464° F. when tested with a load of 264 psi. 
     
     
         7 . The heat retentive server according to  claim 1 , wherein:
 the body has an upper shell and a lower shell that are connected to one another, and the chamber is defined between the upper shell and the lower shell; and   the thermal material comprises buffering material positioned between the induction-heatable member and the upper shell.   
     
     
         8 . The heat retentive server according to  claim 7 , wherein the buffering material is in opposing face-to-face contact with both an upper surface of the induction-heatable member and a lower surface of the upper shell. 
     
     
         9 . The heat retentive server according to  claim 7 , wherein the buffering material has a thickness of less than about 0.1 inches. 
     
     
         10 . The heat retentive server according to  claim 7 , wherein the buffering material comprises silicone. 
     
     
         11 . The heat retentive server according to  claim 10 , wherein the buffering material is high temperature Shore A silicone. 
     
     
         12 . The heat retentive server according to  claim 1 , wherein:
 the body has an upper shell and a lower shell that are connected to one another, and the chamber is defined between the upper shell and the lower shell;   the thermal material comprises
 upper buffering material positioned between the induction-heatable member and the upper shell, and 
 lower insulating material positioned between the induction-heatable member and the lower shell; and 
   the upper buffering material is thinner than the lower insulating material.   
     
     
         13 . The heat retentive server according to  claim 12 , wherein the lower insulating material is impregnated with synthetic amorphous silica. 
     
     
         14 . The heat retentive server according to  claim 13 , wherein the lower insulating material is hydrophobic. 
     
     
         15 . The heat retentive server according to  claim 12 , wherein the thermal material comprises intermediate insulating material positioned between the induction-heatable member and the lower insulating material. 
     
     
         16 . The heat retentive server according to  claim 15 , wherein:
 the lower insulating material comprises a layer of silica aerogel; and   the intermediate insulating material comprises a layer of silica aerogel.   
     
     
         17 . The heat retentive server according to  claim 15 , wherein:
 the intermediate insulating material is thicker than the lower insulating material; and   the intermediate insulating material comprises a reinforced layer of silica aerogel.   
     
     
         18 . A heat retentive server comprising:
 a chamber defined between an upper shell and a lower shell that are connected to one another, the upper shell having a heat deflection temperature, and the lower shell having a heat deflection temperature;   an induction-heatable member positioned in the chamber, the induction-heatable member being heatable by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell;   insulation positioned in the chamber between the induction-heatable member and the lower shell, the insulation being adapted for restricting conductive heat transfer from the induction-heatable member to the lower shell so that temperature of the lower shell does not exceed the heat deflection temperature of the lower shell in response to the induction-heatable member being heated by electromagnetic induction to the first temperature; and   buffering material positioned in the chamber between the induction-heatable member and the upper shell, the buffering material being adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell in response to the induction-heatable member being heated by electromagnetic induction to the first temperature, and the second temperature is less than the first temperature.   
     
     
         19 . The heat retentive server according to  claim 18 , wherein the heat deflection temperature of the upper shell is substantially equal to the heat deflection temperature of the lower shell. 
     
     
         20 . The heat retentive server according to  claim 18 , wherein the heat deflection temperature of the upper shell is in a range from about 417° F. to about 511° F. 
     
     
         21 . The heat retentive server according to  claim 18 , wherein the heat deflection temperature of the upper shell is about 464° F. when tested with a load of 264 psi. 
     
     
         22 . A heat retentive server comprising:
 a body having an upper shell and a lower shell that are connected to one another, and a chamber between the upper shell and the lower shell, the upper shell having a heat deflection temperature;   a metallic induction-heatable member positioned in the chamber, the induction-heatable member being heatable by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell;   insulation positioned in the chamber between the induction-heatable member and the lower shell, the insulation being adapted for restricting conductive heat transfer from the induction-heatable member to the lower shell; and   buffering material positioned in the chamber between the induction-heatable member and the upper shell, the buffering material
 being in opposing face-to-face contact with both an upper surface of the induction-heatable member and a lower surface of the upper shell, 
 having a thickness of less than about 0.1 inches, 
 comprising silicone, and 
 providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell in response to the induction-heatable member being heated by electromagnetic induction to the first temperature, and the second temperature is less than the first temperature. 
   
     
     
         23 . A method of heating a heat retentive server comprising an induction-heatable member enclosed within a body having a heat deflection temperature, the method comprising:
 induction heating the induction-heatable member to a temperature greater than the heat deflection temperature of the body while the induction-heatable member is enclosed within the body;   placing a dish that is at about room temperature on the body while the induction-heatable member is enclosed in the body, and allowing heat transfer from the server to the dish upon the body to increase the temperature of the dish; and   placing food on the dish.   
     
     
         24 . The method according to  claim 23 , further comprising washing the dish prior to the placing of the food on the dish, and not heating the dish between the washing of the dish and the placing of the dish on the body. 
     
     
         25 . The method according to  claim 23 , comprising buffering the heat transfer from the server to the dish. 
     
     
         26 . The method according to  claim 23 , comprising covering the food and the dish with an insulated cover while the food and dish are on the server, wherein:
 the food weighs about 12 to about 14 ounces and is at a temperature of about 165° F. when placed on the dish, and   the server and the cover keeping the food at a temperature above 140° F. for one hour after the covering of the food and the dish with the insulated cover.   
     
     
         27 . The method according to  claim 23 , wherein the heat deflection temperature is in a range from about 417° F. to about 511° F., so that the induction heating of the induction-heatable member comprises induction heating the induction-heatable member to greater than a temperature in the range from about 417° F. to about 511° F. 
     
     
         28 . The method according to  claim 23 , wherein the heat deflection temperature is about 464° F. when tested with a load of 264 psi, so that the induction heating of the induction-heatable member comprises induction heating the induction-heatable member to greater than about 464° F. 
     
     
         29 . The method according to  claim 23 , wherein the placing of the dish, which is at about room temperature, on the body occurs while the induction-heatable member, which is enclosed within the body, is at a temperature greater than the heat deflection temperature of the body. 
     
     
         30 . The method according to  claim 29 , wherein the placing of the food on the dish occurs:
 while the dish is at about room temperature, and   prior to the placing of the dish on the body, so that the food is upon the dish during the placing of the dish on the body.