Organic particulate loaded polishing pads and method of making and using the same

Abstract

Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

1 . A polishing pad comprising:
 a sheet having a first major side and a second major side opposite the first major side, and   a plurality of polishing elements extending outwardly from the first major side along a first direction substantially normal to the first major side, wherein at least a portion of the polishing elements are integrally formed with the sheet and laterally connected so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to a polishing surface of the polishing elements, wherein at least a portion of the plurality of polishing elements comprise an organic particulate filler in a continuous polymer phase.   
     
     
         2 . A polishing pad comprising a support layer having a first major side and a second major side opposite the first major side, and
 a plurality of polishing elements bonded to the first major side of the support layer, wherein each polishing element has an exposed polishing surface, and   wherein the polishing elements extend from the first major side of the support layer along a first direction substantially normal to the first major side, further wherein at least a portion of the plurality of polishing elements comprise an organic particulate filler in a continuous polymer phase.   
     
     
         3 . The polishing pad of  claim 2 , wherein each polishing element is affixed to the first major side by bonding to the support layer. 
     
     
         4 - 16 . (canceled) 
     
     
         17 . The polishing pad of  claim 2 , wherein each polishing element is thermally bonded to the support layer. 
     
     
         18 . The polishing pad of  claim 2 , wherein the support layer comprises a thermoplastic polyurethane 
     
     
         19 . The polishing pad of  claim 1  further comprising a compliant layer affixed to the second major side opposite the plurality of polishing elements. 
     
     
         20 - 23 . (canceled) 
     
     
         24 . The polishing pad of  claim 1 , wherein each polishing element extends along the first direction at least about 0.25 mm above a plane including the first major side. 
     
     
         25 . The polishing pad of  claim 1 , wherein the continuous polymer phase comprises a thermoplastic polyurethane, an acrylated polyurethane, an epoxidized polyurethane, an epoxidized rubber, a vinyl resin, a cyclopentadiene resin, a vinyl ether resin, and combinations thereof. 
     
     
         26 . The polishing pad of  claim 1 , wherein the organic particulate filler comprises at least one of a thermoplastic polymer, a thermoset polymer, a water soluble polymer, or combinations thereof. 
     
     
         27 . The polishing pad of  claim 26 , wherein the organic particulate filler comprises at least one of a polyolefin, a cyclic polyolefin, a polyolefinic thermoplastic elastomer, polyvinyl alcohol, poly(ethylene oxide), poly (vinyl alcohol), poly (vinyl pyrrolidone), polyacrylic acid, poly(meth)acrylic acid, or combinations thereof. 
     
     
         28 - 42 . (canceled) 
     
     
         43 . The polishing pad of  claim 2 , wherein at least one of the polishing elements is a transparent polishing element. 
     
     
         44 - 45 . (canceled) 
     
     
         46 . The polishing pad of  claim 1 , further comprising at least one transparent polishing element affixed to a transparent portion of the sheet. 
     
     
         47 . A method of using a polishing pad comprising:
 contacting a surface of a substrate with a polishing surface of the polishing pad of  claim 1 ; and   relatively moving the polishing pad with respect to the substrate to abrade the surface of the substrate.   
     
     
         48 . (canceled) 
     
     
         49 . A method of making a polishing pad according to  claim 1 , comprising:
 dispersing an organic particulate filler in a curable composition comprising a curable polymer precursor material;   dispensing the curable composition into a mold; and   curing the curable composition in the mold to form a polymeric sheet containing the organic particulate filler dispersed in the at least partially cured polymer precursor material, the polymeric sheet having a first major side and a second major side opposite the first major side, and a plurality of polishing elements extending outwardly from the first major side along a first direction substantially normal to the first major side, wherein the polishing elements are integrally formed with the sheet and laterally connected so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to a polishing surface of the polishing elements.   
     
     
         50 . (canceled) 
     
     
         51 . The method of  claim 49 , wherein dispensing the curable into the mold comprises at least one of reaction injection molding, extrusion molding, compression molding, or a combination thereof. 
     
     
         52 . (canceled) 
     
     
         53 . A method of making a polishing pad according to  claim 2 , comprising:
 forming a plurality of polishing elements comprising an organic particulate filler dispersed in a continuous polymer phase; and   bonding the polishing elements to a first major side of a support layer having a second major side opposite the first major side to form a polishing pad.   
     
     
         54 . The method of  claim 49 , further comprising forming a pattern with the plurality of polishing elements on the first major side. 
     
     
         55 - 69 . (canceled)