Polishing Device
Abstract
The invention describes a polishing device ( 100 ) for polishing a component ( 200 ), comprising an elongated polishing element ( 110 ), which is directed against the surface ( 205 ) of the component ( 200 ) parallel to the longitudinal axis (z) of the component ( 200 ). In this case, the polishing element ( 110 ) is formed in adjustment subsegments ( 110 - 1, 110 - 2, . . . 110 -n) in its longitudinal extent. A housing ( 120 ) serves for receiving the polishing element ( 110 ). Arranged between a bearing surface ( 123 of the housing ( 120 ) and the polishing element ( 110 ) is a pressure-exerting element ( 130 ), for placing and pressing the polishing element ( 110 ) against the component ( 200 ). In this case, the pressure-exerting element ( 130 ) is formed as at least one flexible tube to which pressure can be applied.
Claims
exact text as granted — not AI-modified1 . A polishing device ( 100 ) for polishing a component ( 200 ), comprising an elongate polishing element ( 110 ) that is formed, in a direction of its longitudinal extent, of adjustment segments ( 110 - 1 , 110 - 2 , . . . 110 -n),
a housing ( 120 ) for receiving the polishing element ( 110 ) and a pressure element ( 130 ) between a bearing surface ( 123 ) of the housing ( 120 ) and the polishing element ( 110 ) for adjusting and pressing the polishing element ( 110 ) against the component ( 200 ), characterized in that the pressure element ( 130 ) is formed of several elongate hose sections which are pressurized either separately or simultaneously by being connected with each other.
2 . A device according to claim 1 ,
characterized in that the hose ( 130 ) is pressurized with a hydraulic or pneumatic pressure medium.
3 . A device according to claim 1 ,
characterized in that there is provided a control ( 300 ) for controlling a pressure force of the pressure element ( 130 ).
4 . A device according to claim 1 ,
characterized in that the polishing element ( 110 ) is displaceable within the housing ( 120 ) with the pressure element ( 130 ) along side guide surfaces ( 122 ) transverse to the longitudinal axis Z of the component against the surface of the component ( 200 ) about a displacement part.
5 . A device according to claim 4 ,
characterized in that a stop ( 121 ) is provided in the housing ( 120 ) and that limits the displacement path of the polishing element ( 110 ).
6 . A device according to claim 1 ,
characterized in that the polishing element ( 110 ) is so arranged in the housing ( 120 ) that only a section of the polishing element ( 110 ) projects from the housing ( 120 ) by a projection.
7 . A device according to claim 1 ,
characterized in that the polishing element ( 110 ) is formed as a grindstone.
8 . A device according to claim 1 ,
characterized in that the polishing element ( 110 ) is formed of several sections in a circumferential direction of the component ( 200 ).
9 . (canceled)Cited by (0)
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