Multi-modal data analysis for defect identification

Abstract

A technique for identifying a defect in an object produced by a controllable process is disclosed. A first type of data generated as a result of production of the object by the controllable process is obtained. A second type of data generated as a result of production of the object by the controllable process is obtained. The first type of data and the second type of data are jointly analyzed. A defect is identified in the object based on the joint analysis of the first type of data and the second type of data.

What is claimed is: 
     
         1 . A method for identifying a defect in an object produced by a controllable process, the method comprising the steps of:
 obtaining a first type of data generated as a result of production of the object by the controllable process;   obtaining a second type of data generated as a result of production of the object by the controllable process;   jointly analyzing the first type of data and the second type of data; and   identifying a defect in the object based on the joint analysis of the first type of data and the second type of data.   
     
     
         2 . The method of  claim 1 , wherein the controllable process is adjustable based on the joint analysis of the first type of data and the second type of data. 
     
     
         3 . The method of  claim 1 , wherein the joint analysis step further comprises combining results of a first type of analysis of the first type of data and results of a second type of analysis of the second type of data. 
     
     
         4 . The method of  claim 1 , wherein the joint analysis step further comprises using results of a first type of analysis of the first type of data to affect a second type of analysis of the second type of data. 
     
     
         5 . The method of  claim 1 , wherein the controllable process comprises a semiconductor manufacturing process. 
     
     
         6 . The method of  claim 5 , wherein the semiconductor manufacturing process comprises a silicon wafer manufacturing process and the object produced by the semiconductor manufacturing process comprises a processed wafer. 
     
     
         7 . The method of  claim 6 , wherein the first type of data comprises tool trace data and the second type of data comprises wafer image data. 
     
     
         8 . The method of  claim 7 , wherein the tool trace data is generated by a photolithographic tool. 
     
     
         9 . An article of manufacture for identifying a defect in an object produced by a controllable process, the article comprising a computer readable storage medium including one or more programs which when executed by a computer perform the steps of  claim 1 . 
     
     
         10 . Apparatus for identifying a defect in an object produced by a controllable process, the apparatus comprising:
 a memory; and   a processor coupled to the memory and operative to: (i) obtain a first type of data generated as a result of production of the object by the controllable process; (ii) obtain a second type of data generated as a result of production of the object by the controllable process; (iii) jointly analyze the first type of data and the second type of data; and (iv) identify a defect in the object based on the joint analysis of the first type of data and the second type of data.   
     
     
         11 . The apparatus of  claim 10 , wherein the controllable process is adjustable based on the joint analysis of the first type of data and the second type of data. 
     
     
         12 . The apparatus of  claim 10 , wherein the joint analysis operation further comprises combining results of a first type of analysis of the first type of data and results of a second type of analysis of the second type of data. 
     
     
         13 . The apparatus of  claim 10 , wherein the joint analysis operation further comprises using results of a first type of analysis of the first type of data to affect a second type of analysis of the second type of data. 
     
     
         14 . The apparatus of  claim 10 , wherein the controllable process comprises a semiconductor manufacturing process. 
     
     
         15 . The apparatus of  claim 14 , wherein the semiconductor manufacturing process comprises a silicon wafer manufacturing process and the object produced by the semiconductor manufacturing process comprises a processed wafer. 
     
     
         16 . The apparatus of  claim 15 , wherein the first type of data comprises tool trace data and the second type of data comprises wafer image data. 
     
     
         17 . The apparatus of  claim 16 , wherein the tool trace data is generated by a photolithographic tool. 
     
     
         18 . A system for controlling a controllable process that produces an object, the system comprising:
 one or more analyzers coupled to the controllable process and configured to: (i) obtain a first type of data generated as a result of production of the object by the controllable process; (ii) obtain a second type of data generated as a result of production of the object by the controllable process; (iii) jointly analyze the first type of data and the second type of data; and (iv) identify a defect in the object based on the joint analysis of the first type of data and the second type of data;   wherein the controllable process is adjustable based on the joint analysis of the first type of data and the second type of data;   wherein the joint analysis is performed by a processor.   
     
     
         19 . The system of  claim 18 , wherein the joint analysis further comprises combining results of a first type of analysis of the first type of data and results of a second type of analysis of the second type of data. 
     
     
         20 . The system of  claim 18 , wherein the joint analysis further comprises using results of a first type of analysis of the first type of data to affect a second type of analysis of the second type of data.