Heat dissipation device

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.

What is claimed is: 
     
         1 . A heat dissipation device adapted for dissipating heat generated from electronic components having different heights, the heat dissipation device comprising:
 a base plate; and   a first heat absorbing member and a second heat absorbing member extending from the base plate and having different heights for thermally contacting the electronic components having different heights.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the first heat absorbing member comprises a first connecting plate extending from a first side of the base plate and a first heat absorbing plate bent from the first connecting plate, the second heat absorbing member comprises a second connecting plate extending from the first side of the base plate and a second heat absorbing plate bent from the second connecting plate, the first and second heat absorbing plates are spaced from the base plate and respectively contact different electronic components, and a height of the first connecting plate away from the first side of the base plate is different from that of the second connecting plate. 
     
     
         3 . The heat dissipation device of  claim 2 , wherein the first connecting plate and the second connecting plate are perpendicular to the base plate and the first and second heat absorbing plates. 
     
     
         4 . The heat dissipation device of  claim 2 , wherein the first and second connecting plates are aligned with and parallel to each other, and the first and second heat absorbing plates are aligned with and parallel to each other. 
     
     
         5 . The heat dissipation device of  claim 2 , wherein each of the first heat absorbing member and the second heat absorbing member is an elastic sheet and has an L-shaped configuration. 
     
     
         6 . The heat dissipation device of  claim 1 , wherein the first and second heat absorbing members are integrally formed with the base plate as a single piece. 
     
     
         7 . The heat dissipation device of  claim 1 , wherein a heat absorbing block is embedded in the base plate, and one end of the heat absorbing block is beyond the base plate adapted for thermally connecting another electronic component and absorbing heat from the another electronic component. 
     
     
         8 . The heat dissipation device of  claim 7 , wherein a height of the end of the heat absorbing block away from the base plate is different from that of the first heat absorbing member or the second heat absorbing member. 
     
     
         9 . The heat dissipation device of  claim 7 , wherein the heat absorbing block is a solid metal block or a vapor chamber. 
     
     
         10 . The heat dissipation device of  claim 1 , wherein a plurality of heat pipes are arranged on the base plate to transfer heat absorbed by the first and second heat absorbing members. 
     
     
         11 . The heat dissipation device of  claim 10 , wherein each of the heat pipes comprises an evaporator section and two arc-shaped condenser sections extending from opposite ends of the evaporator section, the evaporator sections are aligned with each other and located at a central portion of the base plate, and the condenser sections are located at opposite ends of the base plate. 
     
     
         12 . The heat dissipation device of  claim 11 , wherein the evaporator sections intimately contact each other. 
     
     
         13 . The heat dissipation device of  claim 10 , wherein a covering plate covers the base plate, and opposite surfaces of the heat pipes respectively abut the covering plate and the base plate. 
     
     
         14 . The heat dissipation device of  claim 13 , wherein a plurality of fins is formed on the covering plate. 
     
     
         15 . The heat dissipation device of  claim 13 , wherein two supporting members are located at lateral sides of the heat pipes and opposite surfaces thereof abut the covering plate and the base plate. 
     
     
         16 . A heat dissipation device comprising:
 a base plate;   a first heat absorbing member extending from the base plate; and   a heat absorbing block extending through the base plate, one end of the heat absorbing block exceeding the base plate, a height of the heat absorbing block exceeding the base plate being different from a height of the first heat absorbing member away from the base plate, the heat absorbing block and the first heat absorbing member being adapted for thermally contacting different electronic components respectively.   
     
     
         17 . The heat dissipation device of  claim 16 , further comprising a second heat absorbing member extending from the base plate, wherein a height of the second heat absorbing member away from the base plate is different from the height of the heat absorbing block exceeding the base plate, and thermally contacts another electronic component. 
     
     
         18 . The heat dissipation device of  claim 16 , wherein a plurality of heat pipes are arranged on the base plate to transfer heat absorbed by the first heat absorbing member and the heat absorbing block. 
     
     
         19 . The heat dissipation device of  claim 18 , wherein each of the heat pipes comprises an evaporator section and two arc-shaped condenser sections extending from opposite ends of the evaporator section, the evaporator sections are aligned with each other and located at a central portion of the base plate, and the condenser sections are located at opposite ends of the base plate. 
     
     
         20 . The heat dissipation device of  claim 19 , wherein a covering plate covers the base plate, and opposite surfaces of the heat pipes respectively abut the covering plate and the base plate.