Stamped feature for visual pattern recognition

Abstract

A lead frame for insert molding in a plastic body is provided with an opening defining an edge suitable for detection by pattern recognition systems. During the insert molding process, a pin is positioned in the opening so that the opening remains void of plastic following the injection molding process.

What is claimed is: 
     
         1 . An insert molded component, comprising:
 a plastic body;   an insert molded element in said plastic body;   a wire bonding location on said insert molded element; and   an internal edge in said insert molded element, said internal edge being void of plastic from said body, said internal edge being of sufficient size and location to form a pattern recognition feature for a wire bonding process.   
     
     
         2 . The insert molded component of  claim 1 , said insert molded element being a lead frame having multiple conductive bodies, and at least one of said conductive bodies having an opening defining said internal edge. 
     
     
         3 . The insert molded component of  claim 2 , said opening being round. 
     
     
         4 . The insert molded component of  claim 2 , said opening being rectangular. 
     
     
         5 . The insert molded component of  claim 4 , said opening being square. 
     
     
         6 . The insert molded component of  claim 1 , said insert molded element being a stamped lead frame, and said internal edge being defined by a stamped hole extending through said lead frame. 
     
     
         7 . A molded electrical component, comprising:
 a plastic body;   a stamped lead frame insert molded in said body;   a wire bonding site on said lead frame;   an opening through said lead frame inwardly from external edges of said lead frame, said opening being void of plastic at edges thereof adjacent an outer surface of said lead frame after completion of the insert molding process; and   said opening being of sufficient size and location to define a pattern recognition feature for a wire bonding process when using said electrical component to create a wire bond at said wire bonding site.   
     
     
         8 . The molded electrical component of  claim 7 , said opening being round. 
     
     
         9 . The molded electrical component of  claim 7 , said opening being rectangular. 
     
     
         10 . The molded electrical component of  claim 7 , said plastic body defining a depression aligned with said opening. 
     
     
         11 . The molded electrical component of  claim 7 , said opening being a stamped square opening. 
     
     
         12 . The molded electrical component of  claim 7 , said opening being void of plastic throughout the thickness of said lead frame. 
     
     
         13 . The molded electrical component of  claim 7 , said lead frame including a plurality of wire bonding sites and a plurality of openings through said lead frame, each said opening being inwardly from external edges of said lead frame; said openings being void of plastic at edges thereof adjacent an outer surface of said lead frame after completion of the insert molding process; and
 said openings each being of sufficient size and location to define a pattern recognition feature for a wire bonding process.   
     
     
         14 . The molded electrical component of  claim 13 , said openings being void of plastic throughout the thickness of said lead frame. 
     
     
         15 . A manufacturing process comprising steps of:
 stamping a lead frame in conductive material, including creating an opening through the lead frame inwardly from exterior edges of the lead frame;   loading the lead frame into a mold;   inserting a pin through the opening;   molding a plastic body around the lead frame without filling the opening with plastic to thereby retain an edge of the opening as a feature detectable by a pattern recognition system; and   detecting the edge of the opening to determine a site on the lead frame for creating an electrical connection by wire bonding.   
     
     
         16 . The manufacturing process of  claim 15 , including creating a plurality of the openings through the lead frame; and said step of inserting a pin including inserting a different pin through each of the openings. 
     
     
         17 . The manufacturing process of  claim 15 , including creating a rectangular opening. 
     
     
         18 . The manufacturing process of  claim 15 , including forming a depression in the plastic body aligned with the opening through the lead frame. 
     
     
         19 . The manufacturing process of  claim 18 , including maintaining the opening void of plastic throughout the thickness of the lead frame. 
     
     
         20 . The manufacturing process of  claim 15 , including maintaining the opening void of plastic throughout the thickness of the lead frame.