Hydractive Recipe

Abstract

A method for assembling an adhesive device comprising a first matrix-forming material with holes and a second material, including the following steps: (a) compose the first matrix-forming material with holes; (b) compose the second material with a Tm lower than the Tm of the first material, while enabling increase in the Tm of the second material; (c) assemble the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; (d) increase the Tm of the second material.

1 .- 14 . (canceled) 
     
     
         15 . An adhesive device wherein the adhesive device or part of the adhesive device is prepared by a method comprising:
 (a) providing a first matrix-forming material with holes;   (b) providing a second material with a Tm lower than the Tm of the first matrix-forming material, while enabling increase in the Tm of the second material;   (c) assembling the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; and   (d) increasing the Tm of the second material.   
     
     
         16 . The adhesive device according to  claim 15 , wherein the increase in the Tm of the second material is obtained by adding a melting point lowering substance to the second material. 
     
     
         17 . The adhesive device according to  claim 16 , wherein the melting point lowering substance is a solvent. 
     
     
         18 . The adhesive device according to  claim 16 , wherein the increase in Tm of the second material is obtained by evaporation of the melting point lowering substance. 
     
     
         19 . The adhesive device according to  claim 16 , wherein the melting point lowering substance is a plasticiser. 
     
     
         20 . The adhesive device according to  claim 16 , wherein the increase in Tm of the second material is obtained through migration of the melting point lowering substance into the matrix-forming material. 
     
     
         21 . The adhesive device according to  claim 15 , wherein the enablement of increase in the Tm of the second material is obtained by adding a two component reactive polymer system to the second material. 
     
     
         22 . The adhesive device according to  claim 21 , wherein the increase in Tm of the second material is obtained by inducing a reaction of the two component reactive polymer system. 
     
     
         23 . The adhesive device according to  claim 15 , wherein increase in Tm of the second material is obtained through migration of the second component of a two component reactive polymer system from the first matrix-forming material to the second material, and the second material comprises the second component of the reactive polymer system, followed by induction of a reaction of the two component reactive polymer system. 
     
     
         24 . The adhesive device according to  claim 15 , wherein the Tm of the second material is 10° C. higher than the Tm of the matrix-forming material. 
     
     
         25 . The adhesive device according to  claim 15 , wherein at least one of the materials is a skin friendly adhesive. 
     
     
         26 . The adhesive device according to  claim 25 , wherein the first matrix-forming material is skin friendly. 
     
     
         27 . The adhesive device according to  claim 15 , wherein the holes in the first matrix-forming material are provided with a laser. 
     
     
         28 . The adhesive device according to  claim 15 , wherein the second material is skin friendly.