Compositions and Methods for Removing Organic Substances

Abstract

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

We claim: 
     
         1 . A composition for cleaning organic resin from inorganic substrates comprising:
 a solvent or mixture of solvents; and   at least one sulfonated polyester at a weight % of greater than 10.0%,   wherein the solvent is selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol, diethylene glycol ethyl ether, diethylene glycol methyl ether, diethylene glycol butyl ether, diethylene glycol propyl ether, ethylene glycol propyl ether, ethylene glycol butyl ether and mixtures thereof.   
     
     
         2 . The composition according to  claim 1 , wherein the solvent is at a weight % of from about 40% to about 97%. 
     
     
         3 . The composition according to  claim 2 , wherein the solvent is at a weight % of from about 60% to about 90%.