Hermetically sealed glass package and method of manufacture

Abstract

A method for manufacturing a hermetically sealed package is provided, using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates.

We claim: 
     
         1 . A method for manufacturing a hermetically sealed package using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates, the method comprising the steps of:
 directing the laser to enter the frit pattern, to trace the frit pattern, to retrace a portion of the frit pattern, and to exit the frit pattern; and   selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal;   increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to cause the frit to form a hermetic seal; and   decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to cause the frit to form a hermetic seal before the laser exits the frit pattern.   
     
     
         2 . The method of  claim 1  wherein the substrates comprise plates. 
     
     
         3 . The method of  claim 1  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 3 mm in length. 
     
     
         4 . The method of  claim 1  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 5 mm in length. 
     
     
         5 . The method of  claim 1  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 10 mm in length. 
     
     
         6 . The method of  claim 1  wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 5 mm in length. 
     
     
         7 . The method of  claim 1  wherein the second section of the frit pattern, over which the laser power is decreased is at least about 7 mm in length. 
     
     
         8 . The method of  claim 1  wherein the second section of the frit pattern over which the laser power is decreased is at least about 10 mm in length. 
     
     
         9 . The method of  claim 1  wherein the second section of the frit pattern does not overlap the first section of the frit pattern. 
     
     
         10 . The method of  claim 1  wherein the second section of the frit pattern begins at a location of the frit pattern where the laser power was first increased to the target power sufficient to cause the frit to form a hermetic seal. 
     
     
         11 . The method of  claim 1  wherein the second section of the frit pattern overlaps at least a portion of the first section of the frit pattern. 
     
     
         12 . A package comprising:
 a first substrate;   a second substrate; and   a hermetic seal connecting the first and second substrates, wherein the hermetic seal is formed by a frit disposed in a pattern between the two substrates and heated by a laser, and wherein heated by a laser comprises:   directing the laser to enter the frit pattern, to trace the frit pattern, to retrace a portion of the frit pattern, and to exit the frit pattern; and further comprises   selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal;   increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to cause the frit to form a hermetic seal; and   decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to cause the frit to form a hermetic seal before the laser exits the frit pattern.   
     
     
         13 . The package of  claim 12  wherein the first and second substrates comprise plates. 
     
     
         14 . The method of  claim 12  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 3 mm in length. 
     
     
         15 . The method of  claim 12  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 5 mm in length. 
     
     
         16 . The method of  claim 12  wherein the first section of the frit pattern, over which the laser power is increased, is at least about 10 mm in length. 
     
     
         17 . The package of  claim 12  wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 5 mm in length. 
     
     
         18 . The method of  claim 12  wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 7 mm in length. 
     
     
         19 . The method of  claim 12  wherein the second section of the frit pattern, over which the laser power is decreased, is at least about 10 mm in length. 
     
     
         20 . The package of  claim 12  wherein the second section of the frit pattern does not overlap the first section of the frit pattern. 
     
     
         21 . The package of  claim 12  wherein the second section of the frit pattern, over which the laser power is decreased, begins at a location of the frit pattern where the laser power was first increased to the target power sufficient to cause the frit to form a hermetic seal. 
     
     
         22 . The package of  claim 12  wherein the second section overlaps at least a portion of the first section of the frit pattern.