Mold and method for sectionally adjusting cooling efficiency of the mold

Abstract

The present invention provides a method for sectionally controlling a cooling efficiency of a mold. The method comprises steps of: (a) configuring at least a cooling passage including a first section having a first heat-dissipating inner surface area and a second section having a second heat-dissipating inner surface area in the mold; and (b) adjusting the first and the second heat-dissipating inner surface areas unequally by using a heat-dissipating element.

What is claimed is: 
     
         1 . A method for sectionally controlling a cooling efficiency of a mold, comprising steps of:
 configuring at least a cooling passage including a first section having a first heat-dissipating inner surface area and a second section having a second heat-dissipating inner surface area in the mold; and   adjusting the first and the second heat-dissipating inner surface areas unequally by using a heat-dissipating element.   
     
     
         2 . A method as claimed in  claim 1 , wherein the mold includes a hot-stamping die. 
     
     
         3 . A method as claimed in  claim 1 , wherein the heat-dissipating element includes at least one of a fin and a foil. 
     
     
         4 . A method as claimed in  claim 1 , wherein the step of adjusting the first and the second heat-dissipating inner surface areas is performed by increasing at least one of the first heat-dissipating inner surface area and the second heat-dissipating inner surface area. 
     
     
         5 . A method as claimed in  claim 1 , wherein the cooling passage includes a first and a second cooling sub-passages having the first and the second heat-dissipating inner surface areas respectively. 
     
     
         6 . A method as claimed in  claim 1 , wherein the first and the second sections are disposed in different locations of the mold. 
     
     
         7 . A method as claimed in  claim 1 , wherein the cooling passage includes an upstream and a downstream sections, the first section is located at the upstream section, and the second section is located at the downstream section. 
     
     
         8 . A method for sectionally controlling a cooling efficiency of a mold, comprising steps of:
 configuring a cooling passage having a heat-dissipating inner surface area in the mold; and   disposing a heat-dissipating element in the cooling passage for causing the heat-dissipating inner surface area to be inhomogeneous.   
     
     
         9 . A method as claimed in  claim 8 , wherein the heat-dissipating element includes at least one of a fin and a foil. 
     
     
         10 . A method as claimed in  claim 8 , wherein the cooling passage includes an upstream and a downstream sections, and the heat-dissipating element is disposed at one of the upstream section and the downstream section. 
     
     
         11 . A method as claimed in  claim 8 , wherein the cooling passage includes a first and a second cooling sub-passages having different heat-dissipating inner surface areas. 
     
     
         12 . A method as claimed in  claim 11 , wherein the first and the second cooling sub-passages are disposed in different locations of the mold. 
     
     
         13 . A method as claimed in  claim 8 , wherein the mold includes a hot-stamping die. 
     
     
         14 . A mold for molding an object comprising:
 a cooling passage device having a heat-dissipating inner surface area; and   a heat-dissipating element disposed in the cooling passage device for causing the heat-dissipating inner surface area to be inhomogeneous.   
     
     
         15 . A mold as claimed in  claim 14 , further comprising:
 a lower mold base having a top surface and including a cooling channel disposed on the top surface; and   a lower mold cover disposed above the lower mold base, and covering the cooling channel to form the cooling passage device.   
     
     
         16 . A mold as claimed in  claim 15 , wherein the heat-dissipating element is disposed on at least one of the lower mold base and the lower mold cover. 
     
     
         17 . A mold as claimed in  claim 14 , wherein the mold includes a hot-stamping die. 
     
     
         18 . A mold as claimed in  claim 14 , wherein the heat-dissipating element includes at least one of a fin and a foil. 
     
     
         19 . A mold as claimed in  claim 14 , wherein the cooling passage device includes a first and a second cooling passages, and the heat-dissipating element is disposed in at least one of the first and the second cooling passages. 
     
     
         20 . A mold as claimed in  claim 19 , wherein the first and the second cooling passages are disposed in different locations of the mold.