Electronic device contact structures

Abstract

Electronic device contact structures are disclosed.

What is claimed: 
     
         1 - 18 . (canceled) 
     
     
         19 . A device, comprising:
 a semiconductor die having a surface layer with a first side and a second side, the first side being opposite the second side;   a first conductive pad disposed along the first side of the surface layer of the semiconductor die;   a second conductive pad disposed along the second side of the surface layer of the semiconductor die;   a plurality of conductive contacts in electrical contact with at least one of the first and second conductive pads and extending from at least one of the first and second conductive pads toward a central area of the semiconductor die; and   an insulating layer disposed between an interior portion of at least some of the plurality of conductive contacts and the top layer of the semiconductor die.   
     
     
         20 - 33 . (canceled) 
     
     
         34 . A device, comprising:
 a rectangular light emitting diode (LED) having a surface layer with a first side and a second side, the first side being opposite the second side;   a first conductive pad disposed along the first side of the surface layer of the rectangular LED;   a second conductive pad disposed along the second side of the surface layer of the rectangular LED; and   a plurality of conductive contacts in electrical contact with at least one of the first and second conductive pads and extending from at least one of the first and second conductive pads toward a central area of the rectangular LED.   
     
     
         35 . The device of  claim 34 , wherein the rectangular LED has a third side and a fourth side and the first and second sides are longer than the third and fourth sides. 
     
     
         36 . The device of  claim 35 , wherein the plurality of conductive contacts extend parallel to the third side and the fourth side. 
     
     
         37 . The device of  claim 34 , wherein during use heat dissipation is substantially the same across the rectangular LED. 
     
     
         38 . The device of  claim 34 , wherein during use power dissipation is substantially the same across the rectangular LED. 
     
     
         39 . The device of  claim 34 , wherein the rectangular LED is a photonic lattice light emitting diode. 
     
     
         40 . The system of  claim 34 , wherein an aspect ratio of the surface layer of the rectangular LED is 4×3. 
     
     
         41 . The system of  claim 34 , wherein an aspect ratio of the surface layer of the rectangular LED is 16×9. 
     
     
         42 . The system of  claim 34 , further comprising an insulating layer disposed between an interior portion of one of the plurality of conductive contacts and the surface layer of the rectangular LED. 
     
     
         43 . The system of  claim 34 , further comprising an insulating layer disposed between a portion of at least one of the first and second conductive pads and the surface layer of the rectangular LED. 
     
     
         44 - 45 . (canceled) 
     
     
         46 . A device comprising:
 a stack of materials having a surface; and   a contact structure disposed on the surface of the stack of materials, the contact structure comprising:   a patterned conductive layer configured such that during use a heat generation across the patterned conductive layer is about the same at a plurality of segments disposed across the patterned conductive layer.