Heat distribution structure, manufacturing method for the same and heat-dissipation module incorporating the same

Abstract

A heat distribution structure, a method for manufacturing the same and a heat-dissipation module incorporating the same are disclosed. The heat distribution structure includes a first cap with a first grove and a second cap with a second groove and a support body interposed between the first cap and the second cap, wherein microstructures are formed at the bottoms of the first groove and the second groove and through holes are formed in the support body. The support body is interposed between the first and second caps, such that a cavity is formed by the first cap, the support body and the second cap. A working fluid is contained in the cavity that flows therein through capillary action provided by the microstructures of the first and second grooves and the through holes in the support body, thus evenly distributing heat in the heat distribution structure.

What is claimed is: 
     
         1 . A heat distribution structure comprising:
 a first cap formed with a first groove and a second cap formed with a second groove, and a plurality of microstructures formed at bottoms of the first groove and the second groove;   a support body formed with a plurality of through holes interposed between the first cap and the second cap, wherein the first groove and the second groove face the support body, such that a cavity is formed by the first cap, the support body and the second cap; and   a working fluid accommodated in the cavity that flows within the cavity via the microstructures and the through holes.   
     
     
         2 . The heat distribution structure of  claim 1 , wherein a plurality of microstructures are further formed on a sidewall of the first groove, a sidewall of the sealed groove, or the sidewalls of the first groove and the second groove. 
     
     
         3 . The heat distribution structure of  claim 1 , wherein the cavity is in a vacuum state. 
     
     
         4 . The heat distribution structure of  claim 1 , wherein the first and the second caps are made of silicon material. 
     
     
         5 . The heat distribution structure of  claim 1 , wherein the support body is made of glass. 
     
     
         6 . The heat distribution structure of  claim 1 , wherein the working fluid is water. 
     
     
         7 . The heat distribution structure of  claim 1 , wherein the microstructures of the first groove and the second groove are protrusions. 
     
     
         8 . The heat distribution structure of  claim 1 , wherein the first cap, the second cap and the support body are formed into an integrated structure by a high-temperature and high-pressure anodizing process. 
     
     
         9 . A method for manufacturing a heat distribution structure, comprising the steps of:
 (1) forming a plurality of microstructures at bottoms of a first groove of a first cap and a second groove of a second cap, forming a guiding hole on the first cap or the second cap, and forming a plurality of through holes in a support body;   (2) interposing the support body between the first cap and the second cap in a manner of the first groove and the second groove facing the support body, such that a cavity is formed between the first cap, the support body and the second cap; and   (3) introducing a working fluid into the cavity via the guiding hole, and then sealing the guiding hole, such that the working fluid flows within the cavity via the microstructures and the through holes.   
     
     
         10 . The method for manufacturing a heat distribution structure of  claim 9 , wherein step (1) further comprises forming a plurality of microstructures in a sidewall of the first groove, a sidewall of the second groove, or the sidewalls of the first groove and the second groove. 
     
     
         11 . The method for manufacturing a heat distribution structure of  claim 9 , wherein the forming of the microstructures at the bottoms of the first groove and the second groove is performed by etching. 
     
     
         12 . The method for manufacturing a heat distribution structure of  claim 9 , wherein the forming of the through holes in the support body is performed by laser. 
     
     
         13 . The method for manufacturing a heat distribution structure of  claim 9 , wherein the (2) further comprises combining the first cap and the second cap with the support body interposed therebetween under high temperature and high pressure. 
     
     
         14 . The method for manufacturing a heat distribution structure of  claim 9 , wherein, before the sealing of the guiding hole in step (3), step (3) further comprises making the cavity in a vacuum state. 
     
     
         15 . The method for manufacturing a heat distribution structure of  claim 9 , wherein the first cap and the second cap are made of silicon material by a lithography process. 
     
     
         16 . A heat-dissipation module for dissipating heat generated by a die, the heat-dissipation module comprising:
 a heat-dissipation structure;   a thermal interface material applied onto the heat-dissipation structure;   a heat distribution structure provided on the heat-dissipation structure with the thermal interface material interposed therebetween, and an insulating layer provided on a surface of the heat distribution structure away from the thermal interface material, wherein the heat distribution structure comprises:
 a first cap formed with a first groove and a second cap formed with a second groove, and a plurality of microstructures formed at bottoms of the first groove and the second groove; 
 a support body formed with a plurality of through holes interposed between the first cap and the second cap, wherein the first groove and the second groove face the support body, such that a cavity is formed by the first cap, the support body and the second cap; and 
 a working fluid accommodated in the cavity that flows within the cavity via the microstructures and the through holes; 
   a metal layer formed on the insulating layer of the heat distribution structure; and   the die provided on the metal layer.   
     
     
         17 . The heat-dissipation module of  claim 16 , wherein the die is a light emitting diode die. 
     
     
         18 . The heat-dissipation module of  claim 16 , wherein the insulating layer is a silicon dioxide layer.